MC9S12A64CPVE vs S9S12DG25F0MPVE Vergleich
Detaillierter Direktvergleich von MC9S12A64CPVE von NXP Semiconductors und S9S12DG25F0MPVE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S12DG25F0MPVE - 16-bit MCU, 256KB Flash, 25MHz, AEC-Q100 | NXP
S9S12DG25F0MPVE ✓ AktivSpezifikationsvergleich
| Parameter | MC9S12A64CPVE | S9S12DG25F0MPVE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $32,60 | $19,10 |
| Core Processor | HCS12 | HCS12 |
| Core Size | 16-Bit | 16-Bit |
| Architecture | CISC | — |
| Maximale Taktfrequenz | 25 MHz | — |
| Program Memory Type | FLASH | FLASH |
| Program Memory Size | 64KB (64K x 8) | 256 KB (256K x 8) |
| Versorgungsspannung | 2.5V/5V | — |
| Gehäuse | 112-LQFP (20x20 mm) | — |
| Pin-Anzahl | 112 | — |
| Montageart | Surface Mount | Surface Mount |
| External Bus | 8-bit narrow mode supported | — |
| System Module | SIM (System Integration Module) | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | -40°C to +125°C |
| RAM Size | [DATA_NEEDED: SRAM size] | [DATA_NEEDED: RAM size in KB] |
| Number of I/O | [DATA_NEEDED: GPIO count] | 91 |
| ADC Resolution | [DATA_NEEDED: ADC resolution] | — |
| RoHS-Status | Compliant | Compliant |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) | — |
| CPU Speed | — | 25 MHz |
| EEPROM Size | — | 4 KB (4K x 8) |
| Connectivity | — | CANbus, I²C, SCI, SPI |
| Peripherals | — | PWM, WDT |
| ADC | — | 2x 8-channel, 10-bit |
| Timers | — | 8-channel IC/OC Enhanced Capture Timer |
| Gehäuse / Bauform | — | 112-LQFP (20 x 20 mm) |
| Automotive Qualification | — | AEC-Q100 Qualified |
| Lead-Free | — | Yes |