MC9S12B128MPVE vs MC9S12DB128MPVE Vergleich

Detaillierter Direktvergleich von MC9S12B128MPVE von NXP Semiconductors und MC9S12DB128MPVE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12B128MPVE MC9S12B128MPVE - 16-Bit HCS12 MCU 128KB Flash 25MHz | NXP

MC9S12B128MPVE - 16-Bit HCS12 MCU 128KB Flash 25MHz | NXP

MC9S12B128MPVE ✓ Aktiv
NXP Semiconductors
MC9S12DB128MPVE MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP

MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP

MC9S12DB128MPVE ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S12B128MPVE MC9S12DB128MPVE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $8,80 $18,40
Core HCS12 (S12) —
Family MC9S12B-Family (Sturgeon) —
CPU Architecture 16-bit —
Bus Clock Frequency 25 MHz (max) —
Program Flash 128 KB (128K x 8) —
RAM 4 KB —
EEPROM 1 KB (byte-erasable) —
Gehäuse 112-LQFP, 20 x 20 mm —
Montageart Surface Mount Surface Mount (Gull Wing)
Versorgungsspannung 5 V (typical, range 4.5 V - 5.5 V) —
ADC 10-bit, up to 16 channels —
CAN MSCAN12, 1 Mbps, CAN 2.0A/B —
SCI (UART) 2 channels —
SPI 1 channel —
PWM 6 channels (8-bit) —
Betriebstemperatur -40 C to +125 C (automotive) —
MSL-Level 3 —
RoHS-Status Compliant Compliant
Core Architecture — HCS12 (CPU12), 16-bit
Maximum CPU Clock — 25 MHz
Program Memory (FLASH) — 128 KB (128K x 8)
Data Memory (RAM) — 8 KB (8K x 8)
Number of I/O Pins — 91
Oscillator Type — Internal
Gehäuse / Bauform — 112-LQFP (20x20 mm)
Terminal Form — GULL WING
Number of Terminals — 112
Package Code — LQFP
Package Shape — SQUARE
Temperature Grade — AUTOMOTIVE
Packaging — Tray

Datenblätter & Ressourcen

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