MC9S12B256MFUE vs MC9S12D32MFUE Vergleich
Detaillierter Direktvergleich von MC9S12B256MFUE von NXP Semiconductors und MC9S12D32MFUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S12B256MFUE | MC9S12D32MFUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $21,60 | $26,40 |
| Core | HCS12 (16-bit CISC) | — |
| CPU Family | S12B (MC9S12B series) | — |
| Maximum CPU Clock | 25 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| Versorgungsspannung | 2.35 V to 5.5 V | — |
| ADC | 10-bit, 8-channel | — |
| PWM Module | 8-channel, 8-bit | — |
| CAN (msCAN) | 1 x CAN 2.0A/B | — |
| SCI / SPI / I2C | Yes (1 each) | — |
| Enhanced Capture Timer | 6 x 16-bit channels | — |
| Betriebstemperatur | -40 C to +125 C (junction) | — |
| Gehäuse | 80-QFP, 14 x 14 mm, 1.0 mm pitch | 80-QFP (14 x 14 mm) |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 (168 hours) | — |
| RoHS-Status | Compliant | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Lifecycle | NRND (Not Recommended for New Designs) | — |
| Processor Core | — | HCS12 |
| Processor Series | — | S12D |
| Datenbusbreite | — | 16 bit |
| Maximale Taktfrequenz | — | 25 MHz |
| Program Memory Size | — | 32 KB (32K x 8) |
| Program Memory Type | — | Flash |
| RAM Size | — | 4K x 8 bytes |
| EEPROM Size | — | 1K x 8 bytes |
| Number of I/O | — | 59 |
| Connectivity | — | CANbus, I2C, SCI, SPI |
| Peripherals | — | PWM, WDT |
| Operating Voltage | — | 2.5 V / 5 V |
| Pin-Anzahl | — | 80 pins |
| Lebenszyklusstatus | — | NRND |
| RoHS | — | Not stated in verified data |