MC9S12C64MFAE vs MC9S12C32MFAE16 Vergleich

Detaillierter Direktvergleich von MC9S12C64MFAE von NXP Semiconductors und MC9S12C32MFAE16 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12C64MFAE MC9S12C64MFAE - 16-bit HCS12 MCU, 64KB Flash, 25MHz | NXP

MC9S12C64MFAE - 16-bit HCS12 MCU, 64KB Flash, 25MHz | NXP

MC9S12C64MFAE Nrnd
NXP Semiconductors
MC9S12C32MFAE16 MC9S12C32MFAE16 - HCS12 16-Bit MCU 32KB Flash LQFP-48 | NXP

MC9S12C32MFAE16 - HCS12 16-Bit MCU 32KB Flash LQFP-48 | NXP

MC9S12C32MFAE16 Nrnd

Spezifikationsvergleich

Parameter MC9S12C64MFAE MC9S12C32MFAE16
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $5,70 $8,20
Core Processor HCS12 (CPU12 CISC) —
Core Size 16-bit —
Maximum Clock Speed 25 MHz —
Program Memory Size 64KB (64K x 8) —
Program Memory Type FLASH —
RAM Size 4K x 8 —
EEPROM Size N/A (not listed) —
Connectivity CANbus, EBI/EMI, SCI, SPI —
Peripherals POR, PWM, WDT —
Number of I/O 31 —
Supply Voltage Range 2.35 V to 5.5 V (per listings; Vreg supports 2.97 V to 5.5 V external) —
Package Type 48-LQFP (7x7 mm) —
Montageart Surface Mount Surface Mount
Series HCS12 / S12C Family —
On-chip Voltage Regulator Yes (bandgap-based Vreg, generates internal VDD) Yes (bandgap-based VREG)
PLL Yes (on-chip phase-lock loop) —
Packaging Tray —
Lebenszyklusstatus NRND (Not Recommended for New Designs) per NXP product page —
Core Architecture — HCS12 (16-bit CISC)
Family — S12C
Program Memory — 32 KB Flash
RAM — 2 KB
EEPROM — 1 KB
Bus Clock / CPU Frequency — 16 MHz
Supply Voltage (VDD) — 2.97 V to 5.5 V (5 V nominal, 2.5 V mode supported)
Gehäuse — 48-pin LQFP (7x7 mm)
GPIO Count — Up to 38
ADC — 8-channel, 10-bit
Communication Interfaces — SCI (UART), SPI, I2C
Timers — Enhanced Capture Timer (ECT) + PWM channels
On-chip PLL — Yes
Debug Interface — Background Debug Mode (BDM)
Betriebstemperatur — -40 C to +85 C (automotive grade)
RoHS-Status — [DATA_NEEDED: rohs status per part marking]

Datenblätter & Ressourcen

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