MC9S12DJ64MFUE vs MC9S12D64MFUE Vergleich
Detaillierter Direktvergleich von MC9S12DJ64MFUE von NXP Semiconductors und MC9S12D64MFUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S12DJ64MFUE | MC9S12D64MFUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,20 | $8,35 |
| Core Architecture | HCS12 (CISC, 16-bit) | HCS12 (16-bit CISC) |
| CPU Frequency | 25 MHz | — |
| Program Memory | 64 KB Flash (64K x 8) | — |
| RAM Size | 4 KB | — |
| EEPROM Size | 1 KB | — |
| Data Flash (Emulation) | 8 KB shared Flash region [DATA_NEEDED: confirmed address range] | — |
| CAN Modules | 2x msCAN 2.0 A/B | — |
| SCI / SPI | 2x SCI, 1x SPI | — |
| ADC | 8-channel, 10-bit | 2 x 10-bit, 8 channels each (16 ADC channels total) |
| Timers | ECT (Enhanced Capture Timer), 16-bit, 8-channels | — |
| PWM Channels | 8 (4x 16-bit or 8x 8-bit via ECT) | 8 channels |
| GPIO Count | [DATA_NEEDED: exact GPIO count per package] | — |
| Operating Voltage | 5 V (typical, 2.5 V for MCU core via internal regulator) [DATA_NEEDED: full min/max range] | — |
| Betriebstemperatur | -40C to +125C | — |
| Package Type | 80-QFP (14x14 mm) | — |
| Montageart | Surface Mount | Surface Mount (SMD/SMT) |
| Debug Interface | Background Debug Mode (BDM), single-wire | BDM (Background Debug Mode) |
| RoHS-Status | Compliant | Compliant |
| CPU Core | — | S12 CPU V2 |
| Operating Frequency | — | 25 MHz |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 64 KB (64K x 8) |
| Gehäuse | — | 80-QFP (14 x 14 mm), also called PQFP-80 |
| Versorgungsspannung | — | 2.5 V / 5 V |
| Number of I/O | — | 59 |
| Capture/Compare Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC |
| Betriebstemperaturbereich | — | -40 C to +125 C |
| Automotive Qualification | — | AEC-Q100 |
| Packaging Method (tray / reel) | — | Tray |
| Approximate Weight | — | 0.033 oz (per supplier catalog) |
| Watchdog / COP | — | Yes (COP reset, watchdog timer) |