MC9S12E256MPVE vs MC9S12DG256MPVE Vergleich
Detaillierter Direktvergleich von MC9S12E256MPVE von NXP Semiconductors und MC9S12DG256MPVE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S12E256MPVE | MC9S12DG256MPVE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,20 | $75,08 |
| Core | HCS12 | — |
| Core Size | 16-bit | — |
| Maximum CPU Speed | 25 MHz | — |
| Program Memory | 256 KB Flash | — |
| RAM | 16 KB | 12 KB |
| Gehäuse | 112-LQFP (20x20 mm) | 112-LQFP (20 x 20 mm) |
| Pin-Anzahl | 112 | — |
| Versorgungsspannung | 5 V single rail (Vreg internal) | [DATA_NEEDED: Supply Voltage] |
| SCI Modules | 3 (asynchronous serial) | — |
| SPI Modules | 1 | — |
| IIC Modules | 1 (Inter-IC Bus) | — |
| Timer Modules | 3 x 16-bit, 4-channel | — |
| ADC | 8-channel, 10-bit | — |
| PWM Channels | 6 | — |
| Connectivity | EBI/EMI, I2C, SPI, SCI | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature Range] |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| Montageart | Surface Mount | Surface Mount |
| Core Processor | — | HCS12 |
| Core Architecture | — | 16-bit CISC |
| Maximale Taktfrequenz | — | 25 MHz |
| Flash Memory | — | 256 KB (256K x 8) |
| EEPROM | — | 4 KB |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 8 |
| GPIO Count | — | 91 |
| Number of I/O Banks / Ports | — | [DATA_NEEDED: Port Count] |
| Communication Interfaces | — | [DATA_NEEDED: Serial Interfaces (SCI/SPI/CAN)] |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs) |
| RoHS-Status | — | [DATA_NEEDED: RoHS Status] |