MC9S12GC16MFAE vs MC9S12C32VFAE16 Vergleich

Detaillierter Direktvergleich von MC9S12GC16MFAE von NXP Semiconductors und MC9S12C32VFAE16 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12GC16MFAE MC9S12GC16MFAE - 16KB Flash 16-Bit HCS12 MCU | NXP | 48-LQFP

MC9S12GC16MFAE - 16KB Flash 16-Bit HCS12 MCU | NXP | 48-LQFP

MC9S12GC16MFAE Obsolete
NXP Semiconductors
MC9S12C32VFAE16 MC9S12C32VFAE16 - 16-Bit HCS12 MCU, 32KB Flash, 48-LQFP | NXP

MC9S12C32VFAE16 - 16-Bit HCS12 MCU, 32KB Flash, 48-LQFP | NXP

MC9S12C32VFAE16 Nrnd

Spezifikationsvergleich

Parameter MC9S12GC16MFAE MC9S12C32VFAE16
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $4,10 $6,42
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series HCS12 / S12GC —
Core Processor HCS12 (16-bit CISC) —
Core Size 16-bit —
CPU Speed 25 MHz —
Program Memory Size 16 KB (16K x 8) 32 KB (32K x 8)
Program Memory Type Flash Flash
RAM Size 1 KB (1K x 8) 2 KB (2K x 8)
EEPROM Size [DATA_NEEDED: EEPROM size] —
Number of I/O Pins 31 —
Versorgungsspannung 2.5 V / 5 V 2.97 V to 5.5 V (5 V typical)
ADC 8-channel, 10-bit —
Connectivity EBI/EMI, SCI, SPI —
Peripherals POR, PWM, WDT msCAN 2.0 A/B, 8ch 10-bit ADC, ECT, PWM, SPI, SCI (UART)
Gehäuse 48-LQFP (7x7 mm, 0.5 mm pitch) —
Montageart Surface Mount Surface Mount
Operating Temperature Grade Automotive (per Partstack) —
Terminal Form / Pitch GULL WING / 0.5 mm —
Part Status Obsolete (per abc-semi listing) —
Product Family — HCS12 / S12C
Core — HCS12 (CPU12) 16-bit
Number of I/O Lines — 31
Bus Speed — 16 MHz
Oscillator Type — Internal
PLL — Yes (on-chip)
Gehäuse / Bauform — 48-LQFP (7x7 mm)
Package Code — VFAE16 (48-LQFP, 16 MHz grade)
Temperature Range — -40C to +125C
On-chip Voltage Regulator — Yes (bandgap VREG)
Packaging — Tray
MSL-Level — 3 (per JEDEC J-STD-020)
RoHS-Status — Compliant

Datenblätter & Ressourcen

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