MC9S12XEQ384CAG vs MC9S12XDP512VAL Vergleich

Detaillierter Direktvergleich von MC9S12XEQ384CAG von NXP Semiconductors und MC9S12XDP512VAL von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12XEQ384CAG MC9S12XEQ384CAG - 16-bit 50MHz MCU 384KB Flash | NXP

MC9S12XEQ384CAG - 16-bit 50MHz MCU 384KB Flash | NXP

MC9S12XEQ384CAG ✓ Aktiv
NXP Semiconductors
MC9S12XDP512VAL MC9S12XDP512VAL - 16-bit 80MHz HCS12X MCU 512KB Flash | NXP

MC9S12XDP512VAL - 16-bit 80MHz HCS12X MCU 512KB Flash | NXP

MC9S12XDP512VAL ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S12XEQ384CAG MC9S12XDP512VAL
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $11,10
Core Processor HCS12X (16-bit CISC) HCS12X
Core Size 16-bit —
Bus Speed 50 MHz —
Co-processor XGATE RISC co-processor XGATE
Flash Memory 384 KB (384K x 8) —
RAM Size 24K x 8 [DATA_NEEDED: RAM size in KB]
EEPROM Hardware-emulated EEPROM (programmable, flexible) —
ADC Resolution 12-bit —
ADC Conversion Time 3 us —
Timers Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI) —
Memory Protection MPU with supervisor/user modes —
I/O Ports [DATA_NEEDED: I/O Ports count] —
Betriebstemperatur -40C to +85C (TA) [DATA_NEEDED: automotive -40C to +105C or -40C to +125C grade]
Montageart Surface Mount Surface Mount
Gehäuse 144-LQFP (20x20 mm) —
Packaging Tray —
Versorgungsspannung [DATA_NEEDED: Supply Voltage] 2.35 V to 2.75 V
Lifecycle Stage Active —
Core Architecture — 16-bit CISC
Maximum CPU Frequency — 80 MHz
Program Memory Size — 512 KB (512K x 8) Flash
EEPROM Size — [DATA_NEEDED: EEPROM emulation size]
I/O Pins — 119
Package Type — 112-pin LQFP (20 x 20 mm)
CAN Modules — Multiple MSCAN (CAN 2.0A/B)
ADC — 8/10-bit ATD (S12ATD10B8CV3)
Instruction Set Compatibility — Upward-compatible with HCS12
ROM Type — Flash
Lebenszyklusstatus — Active
RoHS-Status — [DATA_NEEDED: RoHS compliance]

Datenblätter & Ressourcen

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