MC9S12XEQ512VAA vs S912XEQ512J2MAA Vergleich

Detaillierter Direktvergleich von MC9S12XEQ512VAA von NXP Semiconductors und S912XEQ512J2MAA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12XEQ512VAA MC9S12XEQ512VAA - 16-bit MCU, 512KB Flash, 50MHz, 80-QFP | NXP

MC9S12XEQ512VAA - 16-bit MCU, 512KB Flash, 50MHz, 80-QFP | NXP

MC9S12XEQ512VAA ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S12XEQ512VAA S912XEQ512J2MAA
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $9,75 $8,60
Core Architecture HCS12X (16-bit) —
CPU Core S12X with XGATE co-processor —
Program Memory (Flash) 512 KB (512K x 8) —
RAM Size 32 KB (32K x 8) —
EEPROM Size [DATA_NEEDED: EEPROM size in bytes] —
Maximum CPU Frequency 50 MHz —
Minimum Instruction Cycle [DATA_NEEDED: instruction cycle time in ns] —
Number of I/O Pins 59 —
Gehäuse / Bauform 80-LQFP (14x14 mm) —
Montageart Surface Mount Surface Mount
Temperature Grade Industrial (VAA suffix) —
Betriebstemperatur -40C to +105C (industrial) -40C to +125C
ADC [DATA_NEEDED: ADC channels and resolution] —
CAN Modules [DATA_NEEDED: number of MSCAN modules] —
Versorgungsspannung [DATA_NEEDED: VDD min/typ/max] 1.8V / 2.8V / 5V
Communication Interfaces SCI (UART), SPI, I2C, CAN [DATA_NEEDED: CAN/LIN/SPI/SCI configuration]
Debug Interface BDM (Background Debug Mode) —
PWM Channels [DATA_NEEDED: number of PWM channels] —
RoHS-Status Compliant [DATA_NEEDED: RoHS status]
MSL-Level [DATA_NEEDED: MSL rating] —
Core Processor — HCS12X (S12X)
Core Size — 16-bit
Maximale Taktfrequenz — 50 MHz
Flash Memory — 512KB (512K x 8)
RAM — [DATA_NEEDED: RAM size]
EEPROM — [DATA_NEEDED: EEPROM size]
Gehäuse — 80-QFP (14x14 mm), PQFP-80
Number of I/O — [DATA_NEEDED: number of I/O]
Qualification — Automotive AEC-Q100 Qualified
Packaging — Tape & Reel (T/R)
Lifecycle Stage — Active
Terminal Form — Gull Wing
Terminal Count — 80

Datenblätter & Ressourcen

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