MC9S12XET256CAG vs S912XEP768J4MAG Vergleich

Detaillierter Direktvergleich von MC9S12XET256CAG von NXP Semiconductors und S912XEP768J4MAG von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12XET256CAG MC9S12XET256CAG - 16-bit 256KB Flash S12X MCU | NXP

MC9S12XET256CAG - 16-bit 256KB Flash S12X MCU | NXP

MC9S12XET256CAG ✓ Aktiv
NXP Semiconductors
S912XEP768J4MAG S912XEP768J4MAG - 16-bit 50MHz MCU, 768KB Flash | NXP

S912XEP768J4MAG - 16-bit 50MHz MCU, 768KB Flash | NXP

S912XEP768J4MAG ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S12XET256CAG S912XEP768J4MAG
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $10,55 $8,45
Core S12X (16-bit CISC) + XGATE co-processor —
CPU Architecture 16-bit HCS12X —
Maximale Taktfrequenz 50 MHz —
Program Memory (Flash) 256 KB (256K x 8) —
RAM 16 KB —
EEPROM (emulated) 4 KB —
ADC 16-channel, 12-bit —
CAN Modules 4 x CAN 2.0 A/B —
GPIO Up to 119 —
Gehäuse 144-LQFP (20x20 mm) 144-LQFP (20x20 mm)
Versorgungsspannung 3.13 V to 5.5 V (single 5 V supply with on-chip regulator) 1.8V / 2.8V / 5V (per FindIC listing)
Betriebstemperatur -40 C to +85 C (CAG grade, see datasheet) -40C to +125C (automotive grade)
Montageart Surface Mount Surface Mount
MSL-Level 3 (per JEDEC J-STD-020) —
RoHS-Status Compliant —
Debug Interface BDM (Background Debug Mode) —
Memory Protection Unit Yes (supervisor/user modes) —
Core Processor — HCS12X (S12XE)
Core Size — 16-Bit
Speed — 50 MHz
Co-Processor — XGATE RISC thread processor
Flash Program Memory — 768 KB (768K x 8)
RAM Size — 64 KB
ADC Resolution — 12-Bit
ADC Conversion Time — 3 us
Connectivity — CAN, I2C, SCI, SPI
Peripherals — Enhanced Capture Timer (ECT), PIT, RTI, PWM, LVI, COP
Memory Protection — MPU with supervisor/user modes
Terminal Form — Gull Wing
Packaging — Tray
Temperature Grade — Automotive

Datenblätter & Ressourcen

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