MC9S12XHZ256VAG vs S9S12HY64J0CLH Vergleich

Detaillierter Direktvergleich von MC9S12XHZ256VAG von NXP Semiconductors und S9S12HY64J0CLH von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12XHZ256VAG MC9S12XHZ256VAG - 16-bit MCU 256KB Flash 80MHz 144-LQFP | NXP

MC9S12XHZ256VAG - 16-bit MCU 256KB Flash 80MHz 144-LQFP | NXP

MC9S12XHZ256VAG Nrnd
NXP Semiconductors
S9S12HY64J0CLH S9S12HY64J0CLH - 16-Bit 32MHz 64KB Flash HCS12 MCU | NXP

S9S12HY64J0CLH - 16-Bit 32MHz 64KB Flash HCS12 MCU | NXP

S9S12HY64J0CLH ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S12XHZ256VAG S9S12HY64J0CLH
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $15,20 $5,85
Core Architecture HCS12X (16-bit) HCS12 (16-bit)
CPU Clock Frequency 80 MHz —
Program Memory (Flash) 256 KB (256K x 8) —
RAM 12 KB 4 KB
Gehäuse 144-LQFP (20x20 mm) 64-pin LQFP (10x10 mm, GULL WING)
Betriebstemperatur -40C to +105C (Automotive) —
Anzahl der Pins 144 —
CAN Channels (MSCAN) 4 —
ADC 16-channel, 10-bit 16-channel 10-bit ATD
Display Controller Integrated TFT driver + LCD driver —
Coprocessor XGATE RISC coprocessor —
PWM Channels 8 channels 8 PWM (periphery dependent)
Debug Interface BDM (Background Debug Mode) + JTAG BDM (Background Debug Mode)
Versorgungsspannung 3.15 V to 5.5 V —
RoHS-Status Compliant [DATA_NEEDED: RoHS status]
Montageart Surface Mount (Gull Wing) Surface Mount
Temperature Grade Automotive (VAG suffix) Industrial (-40C to +85C)
Program Memory — 64 KB Flash
Maximum CPU Speed — 32 MHz
Operating Voltage — 5 V single supply
CAN Module — 1x CAN 2.0
LIN / SCI — Yes (LIN/J2602 capable)
LCD Driver — Integrated segment LCD driver
Stepper Motor Driver — Integrated
GPIOs — [DATA_NEEDED: GPIO count]
Series — S12HY family

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