MCF52100CEP66 vs MCF52210CEP66 Vergleich
Detaillierter Direktvergleich von MCF52100CEP66 von NXP Semiconductors und MCF52210CEP66 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCF52100CEP66 - ColdFire V2 MCU 32-Bit 66MHz 64KB Flash QFN-64
MCF52100CEP66 NrndNXP Semiconductors
MCF52210CEP66 - 32-bit ColdFire V2 MCU, 64KB Flash, USB | NXP
MCF52210CEP66 ✓ AktivSpezifikationsvergleich
| Parameter | MCF52100CEP66 | MCF52210CEP66 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,10 | $8,10 |
| Core Architecture | ColdFire V2 (32-bit RISC) | ColdFire V2 (32-bit RISC) |
| Processor Series | MCF521x | — |
| Maximale Taktfrequenz | 66 MHz | — |
| Program Memory Size | 64 KB (64K x 8) Flash | — |
| RAM Size | 8 KB | — |
| Datenbusbreite | 32 bit | — |
| Versorgungsspannung | 3.3 V | 3.3 V typical (range see datasheet) |
| Betriebstemperaturbereich | -40C to +85C (industrial) [DATA_NEEDED: exact grade] | — |
| Gehäuse | 64-QFN-EP (9x9 mm) with exposed thermal pad | 64-QFN-EP (9x9 mm) with exposed thermal pad |
| Montageart | Surface Mount | Surface Mount |
| Pin-Anzahl | 64 | — |
| Number of I/O Pins | [DATA_NEEDED: exact I/O count] | — |
| ADC | 12-bit [DATA_NEEDED: channel count] | [DATA_NEEDED: ADC resolution and channel count] |
| Communication Interfaces | UART, QSPI, I2C [DATA_NEEDED: counts per peripheral] | UART, I2C, SPI, USB |
| Timers | [DATA_NEEDED: timer count and width] | [DATA_NEEDED: timer count and width] |
| Debug Interface | BDM / JTAG | — |
| RoHS-Status | Compliant | Details available on distributor page |
| MSL-Level | 3 (168 hours) [DATA_NEEDED: confirmation] | — |
| Maximum CPU Frequency | — | 66 MHz |
| Program Memory (Flash) | — | 64 KB (64K x 8) |
| Data Memory (SRAM) | — | [DATA_NEEDED: SRAM size in KB] |
| Betriebstemperatur | — | -40C to +85C (industrial) |
| USB Interface | — | USB 2.0 Full-Speed Device/Host/OTG |
| DMA Channels | — | [DATA_NEEDED: DMA channel count] |
| Tray Packaging | — | Tray (per AiPCBA datasheet header) |
| Manufacturer (Original) | — | Freescale Semiconductor (acquired by NXP) |