MCF5212LCVM80 vs MCF52210CVM80 Vergleich
Detaillierter Direktvergleich von MCF5212LCVM80 von NXP Semiconductors und MCF52210CVM80 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCF5212LCVM80 - ColdFire V2 32-bit MCU 80MHz 256KB Flash | NXP
MCF5212LCVM80 ✓ AktivSpezifikationsvergleich
| Parameter | MCF5212LCVM80 | MCF52210CVM80 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11,50 | $7,34 |
| Core Architecture | ColdFire V2 (32-bit RISC, 68000-derived) | ColdFire V2 (32-bit RISC, 68000-derived) |
| Maximale Taktfrequenz | 80 MHz | — |
| Program Flash Memory | 256 KB (256K x 8) | 64 KB (64K x 8) |
| SRAM | 16 KB | 16 KB |
| Supply Voltage Range | 3.0 V to 3.6 V | — |
| Ethernet Controller | 10/100 Mbps FEC (Fast Ethernet Controller) | — |
| CAN Module | FlexCAN (CAN 2.0b) | — |
| UART Channels | 3 | 3 |
| I2C Channels | 2 | 2 |
| QSPI | Yes (1 channel) | — |
| DMA Channels | 4 x 32-bit | 4 |
| Betriebstemperatur | -40C to +85C (industrial) | -40 C to +85 C (industrial) |
| Gehäuse | 81-MAPBGA (10x10 mm) | 81-MAPBGA (10x10 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Performance | Approximately 1.59 MIPS/MHz (ColdFire V2) | — |
| Debug Interface | BDM (Background Debug Mode) + JTAG | — |
| Maximum CPU Frequency | — | 80 MHz |
| Dhrystone Performance | — | [DATA_NEEDED: Dhrystone 2.1 MIPS] |
| Versorgungsspannung | — | 3.0 V to 3.6 V (3.3 V typical) |
| USB Interface | — | USB On-The-Go (OTG) host/device with integrated PHY |
| SPI Channels | — | 1 |
| ADC | — | [DATA_NEEDED: ADC resolution and channel count] |
| RoHS-Status | — | Compliant |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Lead Free | — | Yes |