MCF52212AE50 vs MCF5213CAF66 Vergleich

Detaillierter Direktvergleich von MCF52212AE50 von NXP Semiconductors und MCF5213CAF66 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MCF52212AE50 MCF52212AE50 - 32-bit ColdFire V2 MCU 50MHz 64KB Flash | NXP

MCF52212AE50 - 32-bit ColdFire V2 MCU 50MHz 64KB Flash | NXP

MCF52212AE50 ⚠ Letzte Bestellmöglichkeit
NXP Semiconductors
MCF5213CAF66 MCF5213CAF66 - ColdFire V2 32-bit MCU 66MHz 256KB Flash | NXP

MCF5213CAF66 - ColdFire V2 32-bit MCU 66MHz 256KB Flash | NXP

MCF5213CAF66 ✓ Aktiv

Spezifikationsvergleich

Parameter MCF52212AE50 MCF5213CAF66
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Letzte Kaufgelegenheit Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $9,40 $19,82
Core Architecture ColdFire V2 (32-bit RISC/M68k-derived) —
Maximum CPU Frequency 50 MHz —
Dhrystone 2.1 Performance 76 MIPS @ 66.80 MHz —
Program Flash 64 KB —
SRAM 16 KB —
Versorgungsspannung 3.3 V (single supply) [DATA_NEEDED: supply voltage range]
Gehäuse 64-pin LQFP (10 x 10 mm) 100-LQFP (14x14 mm)
Montageart Surface Mount Surface Mount
Operating Temperature (Commercial) 0 C to +70 C [DATA_NEEDED: full range for -40C/+85C variant] —
UART Up to 3 —
SPI 1 —
I²C 2 —
USB USB On-The-Go (OTG) - integrated MAC and PHY —
PWM Channels [DATA_NEEDED: PWM channel count] —
DMA Channels 4 —
Timers [DATA_NEEDED: timer/EPIT module count] —
Debug Interface JTAG/BDM (Background Debug Mode) —
ADC [DATA_NEEDED: ADC channels/resolution] —
Temperature Grade Commercial —
Terminal Form GULL WING —
Package Code (JEDEC) LFQFP (Low-profile Fine-pitch QFP) —
Pin-Anzahl 64 —
RoHS-Status [DATA_NEEDED: confirm RoHS per latest distributor listing] [DATA_NEEDED: RoHS status]
Core Processor — ColdFire V2
Core Size — 32-Bit
Maximale Taktfrequenz — 66 MHz
Flash Memory — 256 KB (256K x 8)
Series — MCF521x (KIRIN)
Architecture — RISC (ColdFire, 68K-derived)
SRAM Size — [DATA_NEEDED: SRAM size]
Betriebstemperatur — [DATA_NEEDED: operating temperature range]
Peripherals — [DATA_NEEDED: peripheral list]
Number of I/O — [DATA_NEEDED: number of GPIO]
Connectivity — [DATA_NEEDED: connectivity interfaces]
Lead Time — Can ship immediately (per distributor stock, as of 2026-10-18)

Datenblätter & Ressourcen

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