MCF5274CVM166 vs MCF5307CAI90B Vergleich

Detaillierter Direktvergleich von MCF5274CVM166 von NXP Semiconductors und MCF5307CAI90B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MCF5274CVM166 MCF5274CVM166 - 166MHz 32-Bit ROMless MPU | NXP | BGA

MCF5274CVM166 - 166MHz 32-Bit ROMless MPU | NXP | BGA

MCF5274CVM166 Nrnd
NXP Semiconductors
MCF5307CAI90B MCF5307CAI90B - ColdFire V3 32-Bit MPU, 90MHz, 208-FQFP | NXP

MCF5307CAI90B - ColdFire V3 32-Bit MPU, 90MHz, 208-FQFP | NXP

MCF5307CAI90B ✓ Aktiv

Spezifikationsvergleich

Parameter MCF5274CVM166 MCF5307CAI90B
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $25,75
Product Type 32-bit ROMless integrated microprocessor —
Processor Core ColdFire V2 ColdFire V3
Maximale Taktfrequenz 166 MHz —
Instruction Width 32 bit —
Program Memory Type ROMless —
External Oscillator External —
Gehäuse 256-map BGA, 17 mm x 17 mm 208-FQFP (28 mm x 28 mm)
Montageart Surface mount Surface Mount, Gull-Wing
Nominal I/O Supply Voltage 2.5 V / 3.3 V —
Core Supply Range in Cross-Reference Result 1.4 V to 1.6 V —
Betriebstemperatur -40°C to 85°C —
RAM Organization Reported by Third-Party Listing 64K x 8 —
Program Memory Size [DATA_NEEDED: program memory size] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Number of GPIO Pins [DATA_NEEDED: GPIO pin count] —
Ethernet Interface [DATA_NEEDED: Ethernet interface configuration] —
External Memory Interface [DATA_NEEDED: external memory interface configuration] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Core Architecture — 32-bit RISC (M68k-derived ColdFire)
Maximum Core Frequency — 90 MHz
Performance — 70 MIPS (Dhrystone 2.1)
Instruction Set — ColdFire V3 + MAC (multiply-accumulate)
Versorgungsspannung — 3.3 V
Process Technology — 0.32 um
On-chip SRAM — 4 KB
External Memory Bus — 32-bit (FPM/EDO/SDRAM DRAM supported)
DMA Controller — 4 channels
Timers — 3 timer modules
UART — 2 UARTs
I2C — 1 I2C interface
QSPI — 1 QSPI port
Parallel I/O — 16-bit general-purpose
Temperature Grade — Commercial

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