MCF5274CVM166 vs SCF5250VM120 Vergleich

Detaillierter Direktvergleich von MCF5274CVM166 von NXP Semiconductors und SCF5250VM120 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MCF5274CVM166 MCF5274CVM166 - 166MHz 32-Bit ROMless MPU | NXP | BGA

MCF5274CVM166 - 166MHz 32-Bit ROMless MPU | NXP | BGA

MCF5274CVM166 Nrnd
NXP Semiconductors
SCF5250VM120 SCF5250VM120 - 120MHz ColdFire Microcontroller | NXP

SCF5250VM120 - 120MHz ColdFire Microcontroller | NXP

SCF5250VM120 Unknown

Spezifikationsvergleich

Parameter MCF5274CVM166 SCF5250VM120
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Unknown
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $0,00
Product Type 32-bit ROMless integrated microprocessor 32-bit ROMless microcontroller
Processor Core ColdFire V2 ColdFire V2 MCF52xx
Maximale Taktfrequenz 166 MHz —
Instruction Width 32 bit —
Program Memory Type ROMless —
External Oscillator External —
Gehäuse 256-map BGA, 17 mm x 17 mm 196-LBGA (15 x 15 mm)
Montageart Surface mount —
Nominal I/O Supply Voltage 2.5 V / 3.3 V —
Core Supply Range in Cross-Reference Result 1.4 V to 1.6 V —
Betriebstemperatur -40°C to 85°C [DATA_NEEDED: operating temperature range]
RAM Organization Reported by Third-Party Listing 64K x 8 —
Program Memory Size [DATA_NEEDED: program memory size] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Number of GPIO Pins [DATA_NEEDED: GPIO pin count] —
Ethernet Interface [DATA_NEEDED: Ethernet interface configuration] —
External Memory Interface [DATA_NEEDED: external memory interface configuration] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification]
Architecture — RISC 32-bit
Maximum Processor Frequency — 120 MHz
RAM Size — 128 kB
Program Memory — ROMless
Number of I/O Pins — 57
Versorgungsspannung — 3.3 V
Process Technology — 0.13 um
Package Type — MAP-BGA-196
Tray Packaging — Tray
Manufacturer — NXP Semiconductors
Datasheet File Size — 1 MB
Datasheet Page Count — 56 pages
RoHS-Status — [DATA_NEEDED: RoHS compliance]
REACH Status — [DATA_NEEDED: REACH compliance]

Datenblätter & Ressourcen

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