MCF5274LVF166 vs MCF5275LCVM166 Vergleich
Detaillierter Direktvergleich von MCF5274LVF166 von NXP Semiconductors und MCF5275LCVM166 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCF5274LVF166 - Coldfire V2 32-Bit 166MHz MPU | NXP | 196-MAPBGA
MCF5274LVF166 NrndSpezifikationsvergleich
| Parameter | MCF5274LVF166 | MCF5275LCVM166 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,85 | $19,55 |
| Manufacturer | NXP USA Inc. | — |
| Series | MCF527x | — |
| Core Processor | ColdFire V2 (MCF5xxx) | — |
| Core Size | 32-Bit | — |
| Speed | 166 MHz | — |
| Program Memory Type | ROMless | — |
| Gehäuse / Bauform | 196-LBGA / 196-MAPBGA (15x15 mm) | — |
| Versorgungsspannung | 2.5 V (core) / 3.3 V (I/O) | 3.3 V I/O, internal core rail generated on-chip |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Connectivity | 10/100 Ethernet MAC, USB 2.0 Full-Speed, UART, I2C, SPI | — |
| Peripherals | DMA, Timers, PWM, Hardware Cryptographic Accelerator (AES/DES/SHA) | — |
| Number of I/O | [DATA_NEEDED: number of I/O lines] | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 (168 Hours) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| HTSUS | 8542.31.0001 | — |
| Core Architecture | — | ColdFire V2 (32-bit, variable-length RISC) |
| Maximum Core Clock | — | 166 MHz |
| On-chip SRAM | — | 64 KB |
| Program Memory | — | ROMless (external memory required) |
| Ethernet | — | 10/100 MAC with MII/RMII |
| USB | — | USB 2.0 full-speed device/host |
| UART | — | 2 |
| I2C | — | 2 |
| DMA Channels | — | 16 (eDMA) |
| Timers | — | 4 x 32-bit |
| External Bus | — | 16-bit EBI (SDRAM/SRAM/ROM) |
| Gehäuse | — | 196-LBGA (15x15 mm) |