MCF5280CVM80 vs MCF5280CVM80J Vergleich

Detaillierter Direktvergleich von MCF5280CVM80 von NXP Semiconductors und MCF5280CVM80J von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MCF5280CVM80J MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP

MCF5280CVM80J - ColdFire V2 80MHz 32-bit MCU | NXP

MCF5280CVM80J Obsolete

Spezifikationsvergleich

Parameter MCF5280CVM80 MCF5280CVM80J
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $19,75 $9,10
Core ColdFire V2 —
Core Architecture 32-bit RISC —
Maximale Taktfrequenz 80 MHz —
Program Memory Type ROMless (external memory required) ROMless (external flash required)
Gehäuse 256-MAPBGA (17x17 mm) 256-MAPBGA (17x17 mm)
Montageart Surface Mount (BGA) Surface Mount (BGA)
Ethernet 10/100 MAC integrated 10/100 MAC integrated (MII/RMII interface to external PHY)
CAN Controllers 2x CAN 2.0B —
Versorgungsspannung 3.3 V (typical) —
Betriebstemperatur -40C to +85C (industrial) -40C to +105C (TJ, industrial grade)
On-chip SRAM [DATA_NEEDED: exact SRAM size] —
Debug Module Background Debug Module (BDM) —
EMAC Unit Yes (Enhanced MAC) —
UART [DATA_NEEDED: UART count] —
Series MCF528x MCF528x (ColdFire V2)
Lifecycle NRND (Not Recommended for New Designs) —
RoHS [DATA_NEEDED: RoHS status] —
Manufacturer — NXP Semiconductors (formerly Freescale Semiconductor)
Core Processor — ColdFire V2
Core Size — 32-Bit Single-Core
Maximum CPU Clock — 80 MHz
Temperature Grade — Industrial
Connectivity — CANbus, Ethernet (10/100 MAC), I2C, SPI, UART
Peripherals — DMA, PWM, WDT, 16-bit timers, external memory controller
Program Memory Size — ROMless (0 KB internal flash, code via external bus)
Number of I/O — [DATA_NEEDED: GPIO count from datasheet]
CAN — CAN 2.0 controller integrated
Debug Interface — JTAG / BDM (Background Debug Mode)
MSL-Level — 3 (per JEDEC J-STD-020, typical for MAPBGA)
RoHS-Status — Compliant (Pb-free reflow profile)
Lead-Free Finish — Yes (Matte Tin, SAC solder compatible)

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern