MCF5307AI66B vs MCF5307FT66B Vergleich
Detaillierter Direktvergleich von MCF5307AI66B von NXP Semiconductors und MCF5307FT66B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MCF5307AI66B | MCF5307FT66B |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $36,49 | $16,80 |
| Core Processor | ColdFire V3 (MCF530x) | — |
| Core Size | 32-Bit | — |
| Maximum Clock Speed | 66 MHz | — |
| Performance | 70 MIPS | — |
| Program Memory Type | ROMless | ROMless (external memory required) |
| RAM Size | 4 KB SRAM | — |
| Connectivity | EBI/EMI, I2C, UART/USART | — |
| Peripherals | DMA, POR, WDT | — |
| Number of I/O | 16 | — |
| DRAM Controller | Yes (integrated) | — |
| MAC Module | Yes (multiply-accumulate) | — |
| Gehäuse | 208-FQFP (28x28 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Part Status | End of Life / Not For New Designs | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: temperature grade per device marking] |
| Versorgungsspannung | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: VDD nominal - 3.3 V typical per family datasheet] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: per device marking] |
| Core Architecture | — | ColdFire V3 (MCF530x) |
| Datenbusbreite | — | 32-bit |
| Maximale Taktfrequenz | — | 66 MHz |
| On-chip SRAM | — | 4 KB (4K x 8) |
| Number of I/O Lines | — | 16 |
| Oscillator Type | — | External |
| Gehäuse / Bauform | — | 208-BFQFP (28x28 mm) |
| External Memory Controller | — | Yes (ROM/SRAM/DRAM/Flash) |
| DMA Channels | — | [DATA_NEEDED: DMA channel count] |
| Timers | — | [DATA_NEEDED: timer module count] |
| Serial Interfaces | — | [DATA_NEEDED: UART/SPI/I2C instance count] |
| Packaging (distributor) | — | Tray |