MCF54451CVM180 vs MCF54451VM240 Vergleich
Detaillierter Direktvergleich von MCF54451CVM180 von NXP Semiconductors und MCF54451VM240 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MCF54451CVM180 | MCF54451VM240 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $17,20 | $25,10 |
| Core | ColdFire V4 (V4M) with MMU and EMAC | ColdFire V4 (Version 4 with MMU and EMAC) |
| Core Architecture | 32-bit RISC, Variable-Length Encoding (m68k lineage) | — |
| Maximum Core Frequency | 180 MHz | — |
| Dhrystone 2.1 MIPS | up to 410 MIPS @ 266 MHz (family spec) | — |
| Instruction Cache | 16 KB | 16 KByte |
| Data Cache | 16 KB | 16 KByte |
| Internal SRAM | 32 KB | — |
| Program Memory (ROM/Flash) | ROMless | — |
| Gehäuse | 256-MAPBGA, 17 mm x 17 mm | 256-MAPBGA (17x17 mm) |
| Supply Voltage (Core/IO) | 1.8 V / 2.5 V / 3.3 V | — |
| Ethernet | Integrated MAC (10/100) | — |
| USB | USB On-The-Go (OTG) | — |
| PCI | PCI 2.x interface integrated | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant | — |
| Operating Frequency | — | 240 MHz |
| DMIPS | — | up to 410 Dhrystone 2.1 MIPS |
| Program Memory Type | — | ROMless (external boot flash required) |
| RAM Size | — | 32K x 8 on-chip SRAM |
| I/O Count | — | 132 |
| Versorgungsspannung | — | [DATA_NEEDED: core and I/O rail voltages] |
| Betriebstemperatur | — | -40C to +85C (industrial) |
| Connectivity | — | 10/100 Ethernet MAC, USB OTG, PCI |
| Memory Controller | — | DDR/DDR2 SDRAM + NAND flash controller |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs) |
| Packaging | — | Tray |