MD7IC2050NR1 vs MD7IC2050NBR1 Vergleich
Detaillierter Direktvergleich von MD7IC2050NR1 von NXP Semiconductors und MD7IC2050NBR1 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MD7IC2050NBR1 - 10W W-CDMA RF Power Amplifier 1880-2100MHz | NXP
MD7IC2050NBR1 ✓ AktivSpezifikationsvergleich
| Parameter | MD7IC2050NR1 | MD7IC2050NBR1 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | RF Amplifiers | RF Amplifiers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $21,95 | $22,40 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Number | MD7IC2050NR1 | — |
| Device Type | RF LDMOS Integrated Power Amplifier | — |
| RF Type / Modulation | W-CDMA / 3GPP | — |
| Frequency Range (datasheet typical) | 1.88 GHz to 2.1 GHz | — |
| Frequency Range (broadband match) | 1.75 GHz to 2.05 GHz | — |
| Output Power (Average, W-CDMA) | 10 W | — |
| Supply Voltage (Vdd) | 28 V | — |
| Supply Voltage Range | 26 V to 32 V | — |
| Quiescent Supply Current | 230 mA | — |
| Power Gain (Gp) | 30.5 dB at 2.14 GHz | — |
| Architecture | Two-stage, on-chip matched | Multi-stage RF LDMOS integrated power amplifier |
| Maximum Input Power (CW) | 28 dBm | — |
| Gehäuse / Bauform | TO-270-14 Variant, Flat Leads (TO-270 WB-14) | — |
| Montageart | Surface Mount | Surface Mount (flanged lead) |
| Packaging | Tape & Reel | — |
| RoHS-Status | [DATA_NEEDED: current RoHS status] | — |
| RF Type | — | W-CDMA |
| Frequency Range | — | 1.88 GHz to 2.1 GHz |
| Operating Bandwidth (broader usability) | — | 1750 MHz to 2050 MHz |
| Versorgungsspannung | — | 28 V |
| Supply Current (quiescent) | — | 230 mA |
| Gain | — | 30.5 dB |
| Output Power (P3dB class, datasheet) | — | [DATA_NEEDED: P3dB output power] |
| Average Output Power (W-CDMA) | — | 10 W average |
| Input Matching | — | On-chip, 50 ohm, DC blocked |
| Output Matching | — | On-chip, >5 ohm nominal |
| Enable / Disable | — | Integrated (with quiescent current temperature compensation) |
| ESD Protection | — | Integrated |
| Gehäuse | — | TO-272 WB-14 (CASE 1618-02, plastic overmold) |
| Maximum Junction / Package Temperature | — | 225 C capable plastic |
| RoHS Compliance | — | Compliant (per manufacturer datasheet) |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |