MMA3202EG vs MMA2301EG Vergleich
Detaillierter Direktvergleich von MMA3202EG von NXP Semiconductors und MMA2301EG von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MMA3202EG - ±112.5g/±56.3g Dual-Axis Analog Accelerometer | NXP
MMA3202EG ✓ Aktiv
Spezifikationsvergleich
| Parameter | MMA3202EG | MMA2301EG |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Motion Sensors | Motion Sensors |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,40 | $9,95 |
| Sensortyp | Accelerometer, Dual-Axis (X, Y) | Accelerometer, single-axis (X) |
| Sensing Technology | Capacitive MEMS | — |
| X-Axis Full-Scale Range | ±112.5 g | — |
| Y-Axis Full-Scale Range | ±56.3 g | — |
| X-Axis Sensitivity | 19 mV/g to 21 mV/g | — |
| Y-Axis Sensitivity | 38 mV/g to 42 mV/g | — |
| Bandwidth | 400 Hz (4-pole low-pass filter) | 400 Hz (4-pole low-pass filter, factory trimmed) |
| Ausgangstyp | Analog, ratiometric | Analog, ratiometric voltage |
| Versorgungsspannung | 5 V typical | 5.0 V typical (ratiometric output) |
| Betriebstemperaturbereich | -40 °C to +125 °C | — |
| Gehäuse | 20-pin SOIC wide-body (SOW) | 16-SOIC (SOP-16 wide-body, 7.5 mm) |
| Montageart | Surface Mount | Surface Mount |
| Zero-g Offset | ≈ Vdd/2 (2.5 V nominal) | — |
| Self-Test Pin | Yes | — |
| g-Select Pin | Yes (dual sensitivity) | — |
| Temperature Compensation | On-chip | — |
| Filter Type | 4-pole low-pass Butterworth | 4-pole low-pass (Bessel-type), internal |
| Automotive Grade | AEC-Q100 qualified | — |
| RoHS-Status | Compliant by Exemption | RoHS Compliant |
| Lead-Free Status | Lead Free | — |
| Messbereich | — | ±225 g (full scale); 200 g nominal |
| Axis | — | X (single axis) |
| Sensitivity | — | [DATA_NEEDED: sensitivity mV/g] |
| Zero-g Output | — | [DATA_NEEDED: zero-g output voltage] |
| Betriebstemperatur | — | −40 °C to +125 °C (automotive) |
| Technology | — | MEMS, silicon capacitive surface micromachined |
| Signal Conditioning | — | Integrated ASIC; on-chip temperature compensation |
| External Components Required | — | None (zero-g, full-scale, and filter factory calibrated) |
| Lead Free Status | — | Lead Free – Compliant by Exemption |