MMA6262QR2-FR vs MMA6262QR2 Vergleich
Detaillierter Direktvergleich von MMA6262QR2-FR von NXP Semiconductors und MMA6262QR2 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MMA6262QR2-FR - ±1.5g Dual-Axis Micromachined Accelerometer | NXP
MMA6262QR2-FR NrndNXP Semiconductors
MMA6262QR2 - ±1.5g X/Y Dual-Axis Accelerometer | NXP
MMA6262QR2 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MMA6262QR2-FR | MMA6262QR2 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Motion Sensors | Motion Sensors |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,21 | $5,20 |
| Sensortyp | Accelerometer, dual-axis (X, Y) | Accelerometer, Dual-Axis (X, Y) |
| Acceleration Range | ±1.5 g | ±1.5 g |
| Sensitivity | 800 mV/g (typical, ratiometric) | 740 mV/g to 860 mV/g (at 3.3 V) |
| Ausgangstyp | Analog, ratiometric to VDD | Analog, Ratiometric |
| Number of Axes | 2 (X, Y) | — |
| Bandwidth (-3 dB) | 150 Hz (internal 1-pole LPF) | — |
| Supply Voltage (VDD) | 2.2 V to 3.6 V | 3.15 V to 5.25 V (per MMA6801KW comp doc) |
| Versorgungsstrom | 2 mA (typical) | — |
| Zero-g Output (ratiometric) | VDD/2 (typical) | — |
| Betriebstemperatur | -40 °C to +105 °C | -40 °C to +105 °C [DATA_NEEDED: confirm upper limit from full NXP datasheet] |
| Shock Survival | 2000 g | — |
| Self-Test | Yes (external logic input) | — |
| Gehäuse | 16-QFN-EP, 6 mm x 6 mm, exposed thermal pad | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | RoHS Compliant (Contains Lead in some variants - check datasheet) | RoHS3 Compliant |
| MEMS Process | Capacitive micromachined (surface micromachining) | — |
| Bandwidth (Low-Pass Filter) | — | 150 Hz (1-pole factory-set) |
| Zero-g Offset | — | Factory calibrated, no external trim required |
| Temperature Compensation | — | On-chip, factory-set |
| Gehäuse / Bauform | — | 16-QFN-EP (6x6 mm) |
| Supplier Device Package | — | 16-QFN-EP (6x6) |
| Lead Free Status | — | Contains Lead (per digchip snippet) |
| Sense Technology | — | Capacitive Micromachined (MEMS) |