MPC8245LVV266D vs MPC8245LVV333D Vergleich

Detaillierter Direktvergleich von MPC8245LVV266D von NXP Semiconductors und MPC8245LVV333D von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC8245LVV266D MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D ✗ Abgekündigt
NXP Semiconductors
MPC8245LVV333D MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D Obsolete

Spezifikationsvergleich

Parameter MPC8245LVV266D MPC8245LVV333D
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Ende des Lebenszyklus Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $48,90 $52,75
Manufacturer NXP USA Inc. NXP USA Inc. (formerly Freescale / Motorola)
Part Family PowerQUICC II (MPC82xx) —
Processor Core PowerPC MPC603e (32-bit Power Architecture) —
Core Clock Speed 266 MHz —
Performance 505.4 MIPS —
Number of Cores 1 —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
Core Voltage (Vcc) 1.8 V —
I/O Voltage 3.3 V —
Betriebstemperatur 0C to +105C (industrial, 'D' suffix) 0 C to +105 C (junction)
Gehäuse 352-TBGA (35x35 mm) —
Montageart Surface Mount (BGA) Surface Mount (BGA)
Packaging Tray —
RoHS-Status RoHS compliant (lead-free) [DATA_NEEDED: rohs status not confirmed in verified web data]
Integrated PCI Bridge Yes, 32-bit / 66 MHz PCI —
Memory Controller DDR SDRAM 64-bit SDRAM (PC133), ROM/Flash interface
Lebenszyklusstatus End of Life (per NXP product page) —
Product Category — Microprocessors (MPU)
Core Architecture — PowerPC 603e (Power Architecture technology)
Core Count — 1
Datenbusbreite — 32-bit
Core Frequency — 333 MHz
Integrated Bridge — PCI bridge + memory controller
PCI Interface — PCI 2.2 compliant, 32-bit, up to 66 MHz
Supply Voltage - Core — 2.0 V (L suffix, low-voltage core)
Supply Voltage - I/O — 3.3 V
Gehäuse / Bauform — 352-TBGA (35x35 mm)
Lead-Free / BGA Solder — [DATA_NEEDED: lead-free status not confirmed]

Datenblätter & Ressourcen

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