MPC8245LZU266D vs MPC8245LVV266D Vergleich

Detaillierter Direktvergleich von MPC8245LZU266D von NXP Semiconductors und MPC8245LVV266D von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC8245LZU266D MPC8245LZU266D - 266MHz PowerPC 603e MPU, 352-TBGA | NXP

MPC8245LZU266D - 266MHz PowerPC 603e MPU, 352-TBGA | NXP

MPC8245LZU266D ✓ Aktiv
NXP Semiconductors
MPC8245LVV266D MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D ✗ Abgekündigt

Spezifikationsvergleich

Parameter MPC8245LZU266D MPC8245LVV266D
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Ende des Lebenszyklus
Lagerstatus In Stock In Stock
Stückpreis (USD) $52,40 $48,90
Manufacturer NXP Semiconductors (formerly Freescale) NXP USA Inc.
Series MPC82xx —
Part Status Active —
Core Processor PowerPC 603e —
Number of Cores / Bus Width 1 Core / 32-bit —
Speed (Clock Frequency) 266 MHz —
Performance 505.4 MIPS 505.4 MIPS
Co-Processor / DSP None —
RAM Controllers SDRAM —
Graphics Acceleration No —
Display & Interface Controllers [DATA_NEEDED: display controller details] —
Ethernet [DATA_NEEDED: integrated Ethernet?] —
PCI Interface 32-bit, 33/66 MHz —
Memory Controller Max Frequency 133 MHz (SDRAM), up to 2 GB —
Serial I/O I2C, UART, I2O —
Versorgungsspannung 3.3 V (typ.) —
Process Technology 0.25 um CMOS —
Betriebstemperatur 0 C to +105 C (commercial) 0C to +105C (industrial, 'D' suffix)
Gehäuse 352-TBGA (35 mm x 35 mm) 352-TBGA (35x35 mm)
Montageart Surface Mount Surface Mount (BGA)
Tray Quantity [DATA_NEEDED: tray qty per manufacturer packing] —
RoHS-Status [DATA_NEEDED: confirm per lot] RoHS compliant (lead-free)
Lead-Free Status Lead-free (BGA balls, SnAgCu) —
Part Family — PowerQUICC II (MPC82xx)
Processor Core — PowerPC MPC603e (32-bit Power Architecture)
Core Clock Speed — 266 MHz
Number of Cores — 1
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Core Voltage (Vcc) — 1.8 V
I/O Voltage — 3.3 V
Packaging — Tray
Integrated PCI Bridge — Yes, 32-bit / 66 MHz PCI
Memory Controller — DDR SDRAM
Lebenszyklusstatus — End of Life (per NXP product page)

Datenblätter & Ressourcen

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