MPC8260AZUPJDB vs MPC8260AVVPJDB Vergleich
Detaillierter Direktvergleich von MPC8260AZUPJDB von NXP Semiconductors und MPC8260AVVPJDB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP
MPC8260AZUPJDB ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC8260AZUPJDB | MPC8260AVVPJDB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $165,00 | $134,85 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II (MPC8260A HiP4) | — |
| Core | PowerPC G2, single core | — |
| Datenbusbreite | 32-bit | — |
| Maximale Taktfrequenz | 300 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Core Supply Voltage | 1.9 V to 2.2 V | — |
| I/O Supply Voltage | 3.3 V | — |
| Process Technology | 0.25 micrometer CMOS (HiP4) | 0.25 micrometer CMOS |
| Gehäuse | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA (37.5 x 37.5 mm) |
| Montageart | Surface Mount | Surface Mount (TBGA) |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Communications Processor Module (CPM) | Integrated (FCC, SCC, SMC) | — |
| External Bus | 60x bus, 64-bit data | — |
| RoHS-Status | unknown | RoHS Compliant |
| Packaging | Tray | Tray |
| Lifecycle | End-of-Life / Last Time Buy (per NXP PCN) | — |
| Processor Type | — | MPC82xx PowerQUICC II |
| Core Architecture | — | PowerPC G2, 32-bit |
| Core Frequency | — | 300 MHz |
| Number of Cores | — | 1 |
| Core Voltage | — | 2 V |
| I/O Voltage | — | 3.3 V |
| Bus Interface | — | 60x bus |
| Lead Free Status | — | Lead Free |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |