MPC8544EVTANGA vs MPC8544ECVTANGA Vergleich
Detaillierter Direktvergleich von MPC8544EVTANGA von NXP Semiconductors und MPC8544ECVTANGA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8544EVTANGA - PowerQUICC III 800MHz MPU | NXP
MPC8544EVTANGA ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MPC8544ECVTANGA - PowerQUICC III 32-Bit SoC, 800MHz | NXP
MPC8544ECVTANGA ObsoleteSpezifikationsvergleich
| Parameter | MPC8544EVTANGA | MPC8544ECVTANGA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $245,00 |
| Core Processor | PowerPC e500 | — |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Speed | 800 MHz | — |
| Co-Processors / DSP | Signal Processing; SPE, Security; SEC | — |
| RAM Controllers | DDR, DDR2, SDRAM | DDR, DDR2, SDRAM |
| Graphics Acceleration | No | No |
| Ethernet | 1 GbE MAC | 1 Gbit Ethernet (TSEC + eTSEC) |
| USB | USB 2.0 (per datasheet feature list) | USB 2.0 with integrated PHY |
| PCI / PCIe | PCI and PCI Express | — |
| Operating Voltage (Core) | 0.95 V to 1.05 V | — |
| Betriebstemperatur | 0C to +105C (Tj) | -40C to +105C (industrial grade, per 'A' suffix) |
| Gehäuse | 783-FCPBGA (29x29 mm) | — |
| Series | MPC85xx PowerQUICC III | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Part Status | Obsolete / End of Life per NXP notice | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | — |
| Processor Type | — | MPC85xx PowerQUICC III |
| Core | — | PowerPC e500 |
| Core Width | — | 32-Bit |
| Speed (Clock Frequency) | — | 800 MHz |
| Core Voltage | — | 0.95 V to 1.05 V (1.0 V typical) |
| Co-Processors/DSP | — | Signal Processing (SPE); Security (SEC 2.0) |
| PCI/PCIe | — | PCI Express x4 + PCI-X / PCI |
| Gehäuse / Bauform | — | 783-FCBGA (29x29 mm) |
| Technology | — | CMOS |
| Terminal Form | — | Ball |
| Number of Terminals | — | 783 |
| Package Code | — | HBGA / FCBGA |
| Revision | — | Rev 2.1 (per datasheet title) |