MPC8545PXANGB vs MPC8545PXAQGD557 Vergleich

Detaillierter Direktvergleich von MPC8545PXANGB von NXP Semiconductors und MPC8545PXAQGD557 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC8545PXANGB MPC8545PXANGB - PowerPC e500 800MHz MPU 783-FCBGA | NXP

MPC8545PXANGB - PowerPC e500 800MHz MPU 783-FCBGA | NXP

MPC8545PXANGB ✓ Aktiv
NXP Semiconductors
MPC8545PXAQGD557 MPC8545PXAQGD557 - PowerQUICC III 1GHz SoC | NXP | Networking

MPC8545PXAQGD557 - PowerQUICC III 1GHz SoC | NXP | Networking

MPC8545PXAQGD557 ✓ Aktiv

Spezifikationsvergleich

Parameter MPC8545PXANGB MPC8545PXAQGD557
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Processor Type PowerPC e500 Microprocessor IC, MPC85xx PowerQUICC III —
Core Count 1 —
Core Architecture 32-bit Power Architecture e500 (Book E) —
Maximum Core Frequency 800 MHz —
Core Supply Voltage 1.1 V —
Gehäuse 783-FCBGA (29x29 mm) 783-FCPBGA (29x29 mm), flip-chip
Montageart Surface Mount (BGA) Surface Mount (BGA)
Betriebstemperatur -40C to +105C (industrial grade, [DATA_NEEDED: confirmed Tj spec]) 0C to +105C
Family MPC85xx / PowerQUICC III —
Instruction Set Power Architecture Book E with signal-processing extensions —
On-chip Peripherals [DATA_NEEDED: full peripheral list from datasheet] —
L1 Cache [DATA_NEEDED: I-cache and D-cache sizes] 32 KB instruction + 32 KB data
L2 Cache [DATA_NEEDED: L2 size and configuration] 256 KB unified, with ECC
Memory Interface DDR SDRAM controller (per MPC85xx family) —
Security Features [DATA_NEEDED: hardware crypto accelerators] —
RoHS-Status Compliant (Pb-free) [DATA_NEEDED: RoHS compliance status]
Lead-Free / Halogen-Free [DATA_NEEDED: halogen-free status] —
Architecture — PowerQUICC III (e500 core)
Core — 32-bit Power Architecture e500, 1 core
Maximum CPU Frequency — 1.0 GHz
Memory Controller — DDR2 SDRAM with ECC
Ethernet — 2x Gigabit Ethernet (SGMII)
PCI / PCI-X / PCIe — 3x controllers
Serial RapidIO — Yes (via SerDes)
QUICC Engine — Multi-protocol (TDM / HDLC)
Security Engine — SEC 2.x (AES, DES, SHA, RNG)
DMA — 4-channel
Silicon Revision — R3.1

Datenblätter & Ressourcen

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