MPC8545VTAQGB vs MPC8548VTAQGB Vergleich

Detaillierter Direktvergleich von MPC8545VTAQGB von NXP Semiconductors und MPC8548VTAQGB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC8545VTAQGB MPC8545VTAQGB - 1.0GHz PowerQUICC III e500 MPU | NXP | 783-FCBGA

MPC8545VTAQGB - 1.0GHz PowerQUICC III e500 MPU | NXP | 783-FCBGA

MPC8545VTAQGB ✓ Aktiv
NXP Semiconductors
MPC8548VTAQGB MPC8548VTAQGB - 1GHz PowerQUICC III SoC | NXP | Networking

MPC8548VTAQGB - 1GHz PowerQUICC III SoC | NXP | Networking

MPC8548VTAQGB ✓ Aktiv

Spezifikationsvergleich

Parameter MPC8545VTAQGB MPC8548VTAQGB
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $115,40 $340,00
Core Architecture Power Architecture e500 PowerPC e500
Core Count 1 —
Datenbusbreite 32-bit 32-bit
Maximum Core Frequency 1.0 GHz 1.0 GHz
Instruction Set Power Architecture Book E —
L1 Cache (I/D) [DATA_NEEDED: L1 cache size per core] —
L2 Cache 256 KB —
Memory Controller DDR1/DDR2 SDRAM Dual DDR1/DDR2 with ECC
Ethernet Controllers Dual 10/100/1000 Mbps Gigabit —
PCI Express Lanes Yes (x4/x8) —
Serial RapidIO Yes —
Local Bus Controller Yes (8/16/32-bit) —
Encryption Accelerator IPSec, SSL/TLS, 3DES, SHA —
DMA Controllers 4 channels —
Betriebstemperatur -40C to +105C (VT designation) 0C to +105C (commercial extended, TBD - confirm from datasheet)
Gehäuse 783-ball FCBGA (29x29 mm) —
Montageart Surface Mount Surface Mount (BGA)
Versorgungsspannung 1.0V core, 1.8V/2.5V I/O (typical) —
RoHS-Status [DATA_NEEDED: verified RoHS status from datasheet] Compliant (Pb-free)
MSL-Level [DATA_NEEDED: MSL classification] —
Processor Series — MPC8548 (PowerQUICC III / MPC85xx)
Number of Cores — 1
Process Technology — 90 nm CMOS
Core Supply Voltage — 1.1 V
I/O Supply Voltages — 1.8 V / 2.5 V / 3.3 V
Gehäuse / Bauform — 783-FCBGA (29 x 29 mm)
On-chip SRAM (L2) — [DATA_NEEDED: L2 cache size]
Gigabit Ethernet MACs — 4x tri-speed (10/100/1000)
XAUI / SerDes — Up to 4x XAUI / SGMII lanes
Security Engine — Integrated IPsec/SSL/SRNG
PCI Express — Multiple x1/x2/x4 interfaces

Datenblätter & Ressourcen

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