MPC855TCZQ50D4557 vs MPC860TCZQ50D4 Vergleich
Detaillierter Direktvergleich von MPC855TCZQ50D4557 von NXP Semiconductors und MPC860TCZQ50D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC855TCZQ50D4557 - MPC8xx PowerQUICC MPU, 50 MHz, 357-BGA | NXP
MPC855TCZQ50D4557 ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860TCZQ50D4 ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MPC855TCZQ50D4557 | MPC860TCZQ50D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Ende des Lebenszyklus |
| Core Architecture | PowerPC MPC8xx (MPC860-style) with CPM | PowerPC |
| Core Frequency | 50 MHz | — |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| Floating-Point Unit | Yes (integrated) | — |
| Communication Processor Module (CPM) | Yes (dual-port RAM with RISC serial controller) | — |
| Ethernet MAC | 2 × 10/100 Mbps (MII/RMII via CPM) | — |
| Serial Channels (SCC) | Up to 4 (HDLC/SDLC/UART/Transparent) | — |
| Serial Management Channels (SMC) | 2 | — |
| Gehäuse | 357-ball Plastic BGA (ZQ suffix), 25 × 25 mm, 1.27 mm pitch | 357-PBGA (25x25 mm), ZQ suffix |
| Montageart | Surface Mount | Surface Mount |
| Supply Voltage (Core) | [DATA_NEEDED: Vdd core nominal] | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Betriebstemperatur | 0 °C to +70 °C (commercial grade) | -40C to +95C (industrial) |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | [DATA_NEEDED: explicit RoHS declaration] | Non-Compliant (per NXP product page / DigiChip datasheet) |
| Speed Grade Suffix | ZQ = 50 MHz commercial | — |
| Order Code Suffix | D4557 (customer-specific tape/reel identifier) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Number | — | MPC860TCZQ50D4 |
| Family | — | PowerQUICC / MPC8xx |
| Core | — | MPC8xx - 1 core, 32-bit |
| Core Clock Speed | — | 50 MHz |
| Instruction / Data Cache | — | 4 KB / 4 KB (unified 8KB figure variant-dependent) |
| Betriebsversorgungsspannung | — | 2 V to 3.6 V (per FindIC comparison page) |
| Lead-Free | — | Contains lead (ZQ denotes tin-lead ball finish) |
| CPM (Communications Processor Module) | — | Integrated - HDLC, UART, Ethernet 10 Mbps support |
| DMA Channels | — | 4 |
| Memory Controller | — | Up to 256 MB DRAM with page mode support |
| Process Technology | — | 0.32 um CMOS (per FindIC description) |
| Lebenszyklusstatus | — | End of Life (NXP Last Time Buy window passed) |