MPC855TVR66D4 vs MPC860DTVR66D4 Vergleich
Detaillierter Direktvergleich von MPC855TVR66D4 von NXP Semiconductors und MPC860DTVR66D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC855TVR66D4 - 66MHz PowerQUICC MPC8xx MPU 357-BGA | NXP
MPC855TVR66D4 ✗ Abgekündigt
Spezifikationsvergleich
| Parameter | MPC855TVR66D4 | MPC860DTVR66D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $55,40 | $78,90 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Processor Series | MPC8xx / PowerQUICC | — |
| Core | MPC8xx (single core) | — |
| Datenbusbreite | 32 bit | 32-bit |
| Maximale Taktfrequenz | 66 MHz | — |
| Process Technology | 0.32 µm | — |
| Gehäuse | 357-PBGA (25x25 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0 °C to +95 °C | 0 C to +95 C |
| Ethernet Support | Fast Ethernet (100 Mbps) | — |
| Communication Interfaces | ENET, ATM, HDLC, PCMCIA | — |
| Communication Processor Module | Yes (CPM, dedicated RISC engine) | — |
| Kategorie | Microprocessors (MPU) | — |
| Tray Packaging | Tray | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Core Architecture | — | PowerPC (MPC8xx) |
| Core Count | — | 1 |
| Max Core Frequency | — | 66 MHz |
| Betriebsversorgungsspannung | — | 3.3 V |
| Series | — | MPC8xx / PowerQUICC |
| Gehäuse / Bauform | — | 357-BGA (PBGA, 25x25 mm) |
| Packaging | — | Tray |
| On-chip Peripherals | — | CPM, ENET, ATM, HDLC, PCMCIA |
| Ethernet | — | 10 Mbps x2 |
| Graphics Acceleration | — | No |
| Lead Free Status | — | Lead Free |
| Part Status | — | Not For New Designs |