MPC855TZQ50D4 vs MPC857DSLVR50B Vergleich
Detaillierter Direktvergleich von MPC855TZQ50D4 von NXP Semiconductors und MPC857DSLVR50B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC857DSLVR50B - MPC8xx PowerQUICC MPU 50MHz 357-PBGA | NXP
MPC857DSLVR50B ObsoleteSpezifikationsvergleich
| Parameter | MPC855TZQ50D4 | MPC857DSLVR50B |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,50 | $23,13 |
| Manufacturer | NXP Semiconductors (formerly Freescale, Motorola) | — |
| Series | PowerQUICC MPC8xx | MPC8xx / PowerQUICC |
| Core Architecture | 32-bit Power Architecture | — |
| Core Frequency | 50 MHz | — |
| Number of Cores | 1 | 1 |
| Communications Processor Module (CPM) | Yes (RISC-based offload engine) | — |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC | — |
| ATM Support | Yes (ATM SAR) | — |
| HDLC/SDLC Support | Yes | — |
| PCMCIA Interface | Yes | — |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| MMU | Yes | — |
| Gehäuse | 357-ball PBGA (25 x 25 mm) | 357-PBGA (25x25 mm) |
| Betriebstemperatur | 0C to +95C | 0C to +105C |
| Process Technology | 0.32 um CMOS (per FindIC reference data) | 0.32 um CMOS |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Versorgungsspannung | [DATA_NEEDED: core/IO voltage values] | — |
| Core Processor | — | PowerPC MPC8xx |
| Bus Width | — | 32-bit |
| Core Speed | — | 50 MHz |
| Co-Processors / DSP | — | Communications; CPM |
| RAM Controllers | — | DRAM |
| Graphics Acceleration | — | No |
| Ethernet | — | 10 Mbps (1 port), 10/100 Mbps (1 port) |
| Terminal Form | — | Ball |
| Number of Terminals | — | 357 |
| Package Code | — | BGA |