MPC859TCVR100A vs MPC859TVR100A Vergleich
Detaillierter Direktvergleich von MPC859TCVR100A von NXP Semiconductors und MPC859TVR100A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC859TCVR100A | MPC859TVR100A |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $42,45 | $21,65 |
| Architecture | 32-bit Power Architecture (PowerPC 8xx family) | — |
| Core | MPC8xx 1 Core, 32-Bit | — |
| Core Frequency | 100 MHz | 100 MHz |
| Instruction Set | PowerPC | — |
| Memory Controller | 8/16/32-bit ROM/FLASH/SRAM/DRAM | — |
| Communications Processor Module | Yes (CPM with serial channels) | — |
| Local Bus | 32-bit PC-AT ISA-style (M68000 bus compatible) | — |
| PCMCIA Interface | Yes, 2 card slots supported | — |
| Timers | Four 16-bit timers | — |
| Interrupt Controller | Integrated in SIU | — |
| DMA | Integrated in CPM (peripheral DMA) | — |
| Betriebstemperatur | -40C to +100C | 0 °C to +95 °C |
| Gehäuse | 357-PBGA (25x25 mm) | 357-PBGA (25 mm x 25 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | [DATA_NEEDED: lead-free/RoHS status] | Compliant |
| Operating Voltage (Core) | [DATA_NEEDED: core VDD] | 1.8 V |
| Operating Voltage (I/O) | [DATA_NEEDED: I/O VDD] | 3.3 V |
| Process Technology | [DATA_NEEDED: process node] | 0.18 µm CMOS |
| Processor Series | — | MPC8xx PowerQUICC |
| Core Architecture | — | 32-bit Power Architecture |
| Core Count | — | 1 |
| Integrated Module | — | CPM (Communications Processor Module) |
| Serial Interfaces | — | SCC, FCC, SPI, I2C (via CPM) |
| Datenbusbreite | — | 32-bit |
| Lead-Free Status | — | Lead Free |
| Packaging | — | Tray |