MPC860DPZQ66D4 vs MPC862PZQ66B Vergleich
Detaillierter Direktvergleich von MPC860DPZQ66D4 von NXP Semiconductors und MPC862PZQ66B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP
MPC860DPZQ66D4 ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MPC862PZQ66B - 66MHz PowerQUICC MPU, 357-PBGA | NXP Semiconductors
MPC862PZQ66B ObsoleteSpezifikationsvergleich
| Parameter | MPC860DPZQ66D4 | MPC862PZQ66B |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $25,28 | $62,10 |
| Processor Type | MPC8xx PowerQUICC 32-Bit RISC MPU | MPC8xx PowerQUICC 32-Bit MPU |
| Core | 1 Core, 32-Bit PowerPC | — |
| Operating Frequency | 66 MHz | — |
| Core / I/O Voltage | 3.3 V | — |
| L1 Instruction Cache | 4 Kbyte | — |
| L1 Data Cache | 4 Kbyte | — |
| On-chip RAM (per data sheet) | [DATA_NEEDED: internal SRAM size] | — |
| Co-Processor / DSP | Communications Processor Module (CPM) | — |
| Ethernet | 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) | — |
| DRAM Controller | Yes, up to 256 Mbyte addressable | — |
| Address Bus Width | 32-Bit | — |
| Gehäuse / Bauform | 357-Ball PBGA, 25 x 25 mm | 357-BBGA (PBGA, 25 x 25 mm) |
| Packaging | Tray | Tray |
| Lead-Free Status | Contains Lead | — |
| RoHS-Status | Non-RoHS (legacy BGA, contains lead) | Non-compliant per third-party listing (Contains Pb) |
| Betriebstemperatur | 0C to +70C (commercial grade) | — |
| Part Status | Not For New Designs | — |
| Manufacturer | — | NXP Semiconductors |
| Number of Cores | — | 1 |
| Core Architecture | — | PowerPC + CPM (QUICC) |
| Datenbusbreite | — | 32-bit |
| Maximum Clock Speed | — | 66 MHz |
| Betriebsversorgungsspannung | — | 3.3 V |
| Montageart | — | Surface Mount |
| Lead Free Status | — | Contains Lead |
| Terminal Form | — | Ball |
| Number of Terminals | — | 357 |
| Package Code | — | BGA (PBGA) |
| Series | — | MPC8xx PowerQUICC |
| Temperature Grade | — | Other (per data sheet) |