MPC860PZQ80D4R2518 vs MPC860PZQ80D4 Vergleich
Detaillierter Direktvergleich von MPC860PZQ80D4R2518 von NXP Semiconductors und MPC860PZQ80D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC860PZQ80D4R2518 - PowerQUICC 80MHz SoC | NXP | 357-PBGA
MPC860PZQ80D4R2518 Nrnd
Spezifikationsvergleich
| Parameter | MPC860PZQ80D4R2518 | MPC860PZQ80D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Ende des Lebenszyklus |
| Series | PowerQUICC MPC860 | — |
| Core Architecture | 32-bit PowerPC (Power Architecture) | PowerPC MPC8xx (32-bit) |
| Core Count | 1 | 1 |
| Maximum Core Frequency | 80 MHz | — |
| On-Chip Communications Module (CPM) | Yes (RISC engine for protocol acceleration) | — |
| Ethernet MAC | 10/100 Mbps with MII | 10/100 Mbps (Fast Ethernet) |
| HDLC/SDLC Controllers | Multiple SCCs with HDLC support | — |
| ATM Support | Yes (via CPM SAR) | — |
| PCMCIA Interface | Yes | — |
| Serial Communications Controllers (SCC) | 2 | 2 |
| Serial Management Controllers (SMC) | 2 | 4 |
| SPI / I2C | 1 SPI, 1 I2C | — |
| DMA Channels | 4 | — |
| Gehäuse | 357-PBGA (25x25 mm) | 357-PBGA (25 x 25 mm) |
| Betriebstemperatur | 0C to +95C | [DATA_NEEDED: industrial temp range] |
| Montageart | Surface Mount (BGA) | Surface Mount (PBGA) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Non-compliant (legacy product) |
| Versorgungsspannung | [DATA_NEEDED: core and I/O voltage rails] | — |
| Core Frequency | — | 80 MHz |
| Bit Width | — | 32-bit |
| Family | — | PowerQUICC MPC86x |
| Nominal Supply Voltage | — | 3.3 V |
| On-chip Regulator Output | — | [DATA_NEEDED: internal core voltage nominal] |
| Process Technology | — | 0.32 um CMOS |
| Communications Processor Module (CPM) | — | Integrated |
| PCMCIA Host Adapter | — | Yes |