MPC860TCZQ50D4 vs MPC860TVR50D4 Vergleich
Detaillierter Direktvergleich von MPC860TCZQ50D4 von NXP Semiconductors und MPC860TVR50D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860TCZQ50D4 ✗ Abgekündigt
Spezifikationsvergleich
| Parameter | MPC860TCZQ50D4 | MPC860TVR50D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $16,80 | $58,00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Number | MPC860TCZQ50D4 | — |
| Family | PowerQUICC / MPC8xx | — |
| Core | MPC8xx - 1 core, 32-bit | — |
| Core Architecture | PowerPC | PowerPC 32-bit |
| Core Clock Speed | 50 MHz | — |
| Instruction / Data Cache | 4 KB / 4 KB (unified 8KB figure variant-dependent) | — |
| Betriebsversorgungsspannung | 2 V to 3.6 V (per FindIC comparison page) | — |
| Gehäuse | 357-PBGA (25x25 mm), ZQ suffix | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | -40C to +95C (industrial) | — |
| RoHS-Status | Non-Compliant (per NXP product page / DigiChip datasheet) | [DATA_NEEDED: rohs compliance] |
| Lead-Free | Contains lead (ZQ denotes tin-lead ball finish) | — |
| CPM (Communications Processor Module) | Integrated - HDLC, UART, Ethernet 10 Mbps support | — |
| DMA Channels | 4 | — |
| Memory Controller | Up to 256 MB DRAM with page mode support | DRAM, SRAM, EPROM, Flash |
| Process Technology | 0.32 um CMOS (per FindIC description) | 0.32 µm CMOS |
| Lebenszyklusstatus | End of Life (NXP Last Time Buy window passed) | — |
| Core Count | — | 1 |
| Maximale Taktfrequenz | — | 50 MHz |
| Operating Supply Voltage (Core) | — | 3.3 V |
| Operating Supply Voltage (I/O) | — | 3.3 V |
| Gehäuse / Bauform | — | 357-PBGA (25x25 mm) |
| Instruction Cache | — | 4 Kbyte |
| Data Cache | — | 4 Kbyte |
| Integrated Communications Module (CPM) | — | Yes (SCC, SMC, SPI, I²C, UART) |
| PCMCIA Interface | — | Yes (Type I/II) |
| Betriebstemperaturbereich | — | -40°C to +95°C |
| Series | — | MPC8xx PowerQUICC |
| Lead-Free / Reflow Profile | — | [DATA_NEEDED: reflow profile] |