MPC860TVR50D4 vs MPC860TVR80D4 Vergleich
Detaillierter Direktvergleich von MPC860TVR50D4 von NXP Semiconductors und MPC860TVR80D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC860TVR50D4 | MPC860TVR80D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $58,00 | $14,85 |
| Core Architecture | PowerPC 32-bit | PowerPC + CPM (RISC communications processor) |
| Core Count | 1 | — |
| Maximale Taktfrequenz | 50 MHz | — |
| Operating Supply Voltage (Core) | 3.3 V | — |
| Operating Supply Voltage (I/O) | 3.3 V | — |
| Gehäuse / Bauform | 357-PBGA (25x25 mm) | 357-BGA (PBGA 25x25 mm) |
| Process Technology | 0.32 µm CMOS | 0.32 micrometer CMOS |
| Instruction Cache | 4 Kbyte | 4 KB |
| Data Cache | 4 Kbyte | 4 KB |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) | — |
| PCMCIA Interface | Yes (Type I/II) | — |
| Memory Controller | DRAM, SRAM, EPROM, Flash | DRAM, SRAM, Flash, EDO support |
| Betriebstemperaturbereich | -40°C to +95°C | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | MPC8xx PowerQUICC | — |
| RoHS-Status | [DATA_NEEDED: rohs compliance] | RoHS Compliant |
| Lead-Free / Reflow Profile | [DATA_NEEDED: reflow profile] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-bit RISC |
| Core Frequency | — | 80 MHz |
| Operating Voltage | — | 3.3 V |
| Communication Controllers | — | 3 FCC, 4 SCC, 2 SMC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| Number of Cores | — | 1 |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |