MPC885CZP66 vs MPC885CVR66-FR Vergleich
Detaillierter Direktvergleich von MPC885CZP66 von NXP Semiconductors und MPC885CVR66-FR von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC885CZP66 | MPC885CVR66-FR |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,40 | $12,10 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC, MPC8xx | — |
| Core Architecture | Power Architecture, 32-bit | — |
| Core Count | 1 | 1 |
| Datenbusbreite | 32 bit | — |
| Core Clock Speed | 66 MHz | — |
| Process Technology | 0.18 micrometer CMOS | 0.18 micrometer |
| Versorgungsspannung | 3.3 V (typical) | — |
| Package Type | PBGA (Plastic Ball Grid Array) | — |
| Package Pin Count | 357 | — |
| Package Size | 25 x 25 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Moisture Sensitivity Level | MSL 3 | — |
| Betriebstemperatur | -40C to +100C | -40 C to +100 C |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | RoHS Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-bit Power Architecture |
| Core Speed | — | 66 MHz |
| Core Performance | — | 87 MIPS |
| Supply Voltage (I/O) | — | 3.3 V |
| Supply Voltage (Core) | — | 1.9 V |
| Gehäuse | — | 357-PBGA (25 x 25 mm) |
| Lead Free Status | — | Lead Free |
| Packaging | — | Tray |
| Communications Processor Module (CPM) | — | Integrated, with RISC engine |
| Ethernet MAC | — | Dual 10/100 Mbps via FCCs |
| Memory Controller | — | SDRAM, SRAM, EPROM, Flash support |
| DMA Controller | — | 32-channel |