MPCZ565MVR56 vs SPC5642AF2MVZ3 Vergleich

Detaillierter Direktvergleich von MPCZ565MVR56 von NXP Semiconductors und SPC5642AF2MVZ3 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPCZ565MVR56 MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP

MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP

MPCZ565MVR56 Obsolete
NXP Semiconductors
SPC5642AF2MVZ3 SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 ✓ Aktiv

Spezifikationsvergleich

Parameter MPCZ565MVR56 SPC5642AF2MVZ3
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $52,75 $0,00
Core Architecture Power Architecture (MPC500 family) —
Datenbusbreite 32-bit —
Program Memory Size 1 MB Flash —
RAM Size 64 KB [DATA_NEEDED: exact value] —
Maximale Taktfrequenz 40 MHz —
Supply Voltage Range [DATA_NEEDED: Vdd/Vdd range] —
Betriebstemperaturbereich -40C to +125C -40°C to +105°C
Gehäuse / Bauform 388-ball PBGA —
Montageart Surface Mount Surface Mount
Number of I/O Pins [DATA_NEEDED: exact I/O count] [DATA_NEEDED: Number of I/O Pins]
Floating Point Unit Yes (IEEE 754) —
CAN Controllers 2 (CAN 2.0B) —
ADC Channels 40 (QADC) —
Timers 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count] —
Debug Interface JTAG / OnCE / BDM —
Feuchtigkeitsempfindlichkeitsgrad (MSL) 3 —
Peak Reflow Temperature 260C (40s max) —
Terminal Finish Tin Silver Copper (e1 per JESD-609) —
Automotive Grade Yes —
Process Technology 0.25 micron CMOS —
Device Type — 32-bit automotive microcontroller
Processor Core — Power Architecture core
Architecture — 32-bit
Maximum Operating Frequency — 80 MHz
Flash Memory — 2 MB
Flash Organization — 2M x 8 bits
Family — MPC56xx Qorivva
Temperature Grade — Automotive Grade
Package Type — PBGA-324
Package Body Size — 23 mm x 23 mm
Terminal Form — Ball
Intended Applications — Powertrain, chassis, engine control, transmission control, and industrial applications
Versorgungsspannung — [DATA_NEEDED: Supply Voltage]
RAM Memory — [DATA_NEEDED: RAM Memory]
Security and Diagnostics Features — [DATA_NEEDED: Security and Diagnostics Features]

Datenblätter & Ressourcen

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