MPVZ5004G7U vs MPVZ5010G7U Vergleich
Detaillierter Direktvergleich von MPVZ5004G7U von STMicroelectronics und MPVZ5010G7U von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPVZ5010G7U - 10 kPa Vented Gauge Pressure Sensor, 8-DIP | NXP
MPVZ5010G7U ✓ AktivSpezifikationsvergleich
| Parameter | MPVZ5004G7U | MPVZ5010G7U |
|---|---|---|
| Marke | STMicroelectronics | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5,73 | $7,25 |
| Pressure Type | Vented Gauge | Vented Gauge |
| Operating Pressure Range | 0 kPa to 3.92 kPa (0 to 0.57 PSI) | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Versorgungsspannung | 4.75 V to 5.25 V (5 V typical) | — |
| Ausgangsspannungsbereich | 1.0 V to 4.9 V (ratiometric) | — |
| Ausgangstyp | Analog Voltage (ratiometric) | Analog, ratiometric to Vcc |
| Sensitivity | 1.0 V/kPa (typical, ratiometric to 5 V) | — |
| Betriebstemperatur | 0C to +85C | — |
| Accuracy (Linearity) | +/-1.5% of full-scale span (typical) | — |
| Gehäuse / Bauform | 8-DIP Module (axial port) | — |
| Montageart | Through-Hole | Through-Hole (DIP module with vent tube) |
| Port Style | Axial pressure port with vent | — |
| Output Impedance | [DATA_NEEDED: output impedance] | — |
| Response Time | [DATA_NEEDED: response time] | [DATA_NEEDED: response time ms] |
| Pressure Port | Vented gauge (back-side referenced to ambient) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Moisture Sensitivity | Non-condensing environments only | — |
| Supply Voltage (Vcc) | — | 4.75 V to 5.25 V (5 V typical) |
| Versorgungsstrom | — | 10 mA (maximum) |
| Analog Output Range | — | 0.2 V to 4.7 V |
| Accuracy | — | ±1.5 %FS (0 °C to 85 °C) |
| Betriebstemperaturbereich | — | 0 °C to +85 °C |
| Compensated Temperature Range | — | -10 °C to +60 °C |
| Storage Temperature Range | — | -30 °C to +100 °C [DATA_NEEDED: confirm exact storage spec] |
| Gehäuse | — | 8-DIP Module (Case 1368-01, through-hole) |
| Sensor Technology | — | Piezoresistive silicon micromachined |
| Signal Conditioning | — | On-chip, temperature compensated, calibrated |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Body Height | — | 5.46 mm |