MPX2050GP vs MPX2100GP Vergleich

Detaillierter Direktvergleich von MPX2050GP von NXP Semiconductors und MPX2100GP von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPX2100GP MPX2100GP - 100kPa Vented Gauge Pressure Sensor | NXP

MPX2100GP - 100kPa Vented Gauge Pressure Sensor | NXP

MPX2100GP ✓ Aktiv

Spezifikationsvergleich

Parameter MPX2050GP MPX2100GP
Marke NXP Semiconductors NXP Semiconductors
Kategorie Pressure Sensors Pressure Sensors
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $9,85 $10,40
Pressure Type Vented Gauge Vented Gauge
Operating Pressure Range 0 kPa to 50 kPa (0 PSI to 7.25 PSI) 0 to 14.5 psi (0 to 100 kPa)
Maximum Overload Pressure [DATA_NEEDED: maximum overload pressure] —
Ausgangstyp Analog Wheatstone Bridge (mV) Wheatstone Bridge (analog voltage, ratiometric)
Full-Scale Output (Typ @ 10 V) 40 mV (4 mV/V) —
Zero Offset (Typ) 0 mV —
Supply / Excitation Voltage 10 V typical (max 16 V per datasheet) —
Linearity +/-0.05% to +/-0.1% of FSS (typ) —
Pressure Hysteresis < 0.1% of FSS —
Betriebstemperatur 0C to +85C [DATA_NEEDED: operating temperature range]
Storage Temperature [DATA_NEEDED: storage temperature range] —
Response Time [DATA_NEEDED: response time / bandwidth] —
Port Style Male 0.19" (4.93 mm) Tube Barbed
Gehäuse / Bauform 4-SIP Module (Case 344B-01) —
Montageart Through-Hole (SIP, vertical) Through-Hole
Technology Silicon Piezoresistive, MEMS Silicon piezoresistive, MEMS
Diaphragm Material Monolithic silicon with integrated strain gauge —
Compensation On-chip temperature compensated and laser-trimmed —
Lead-Free / RoHS Yes (RoHS compliant) —
Maximum Overpressure — 58.02 psi (400 kPa)
Full-Scale Span — 40 mV typical at 10 V supply
Offset — 0 mV minimum at 0 kPa
Versorgungsspannung — 10 V typical (ratiometric)
Maximum Operating Current — 6 mA
Port Size — Male 0.19 in (4.93 mm) barbed tube
Gehäuse — 4-SIP Module (Unibody through-hole)
Temperature Compensation — On-chip, calibrated
Termination Style — PCB (SIP pins)
RoHS-Status — unknown

Datenblätter & Ressourcen

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