MPX4115AS vs MPX5500DP Vergleich
Detaillierter Direktvergleich von MPX4115AS von NXP Semiconductors und MPX5500DP von STMicroelectronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPX4115AS - 15-115kPa Absolute Pressure Sensor | NXP Semiconductors
MPX4115AS ObsoleteSTMicroelectronics
MPX5500DP - 500kPa Differential Pressure Sensor | STMicroelectronics
MPX5500DP ✓ AktivSpezifikationsvergleich
| Parameter | MPX4115AS | MPX5500DP |
|---|---|---|
| Marke | NXP Semiconductors | STMicroelectronics |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,95 | $4,86 |
| Pressure Type | Absolute | Differential (Dual Port) |
| Operating Pressure Range | 2.18 PSI to 16.68 PSI (15 kPa to 115 kPa) | — |
| Ausgangstyp | Analog Voltage | Analog Voltage |
| Ausgangsspannungsbereich | 0.2 V to 4.8 V | 0.2 V to 4.7 V |
| Sensitivity | 45.9 mV/kPa (nominal at 5.1 V supply) | — |
| Versorgungsspannung | 4.85 V to 5.35 V (5.1 V nominal) | 5 V (typical) |
| Versorgungsstrom | [DATA_NEEDED: typical quiescent current] | [DATA_NEEDED: supply current] |
| Betriebstemperatur | -40C to +125C | -40C to +125C (per ST datasheet family) |
| Port Style | Male - 0.19 inch (4.93 mm) Tube | — |
| Package Type | 6-SIP Module (through-hole) | — |
| Montageart | Through Hole | Through-Hole (SIP) |
| Body Length/Diameter | 17.9 mm | — |
| On-Chip Signal Conditioning | Yes (bipolar op-amp) | — |
| Temperature Compensation | Yes (on-chip) | — |
| Factory Calibration | Yes (laser-trimmed) | — |
| RoHS-Status | Compliant | Compliant (per ST/NXP product pages) |
| Operating Pressure Max | — | 500 kPa (72.52 PSI) |
| Operating Pressure Min | — | 0 kPa |
| Accuracy | — | [DATA_NEEDED: accuracy %FS] |
| Compensated Temperature | — | 0 C to 85 C |
| Port Size | — | Male 0.19" (4.93 mm) Tube, Dual |
| Gehäuse | — | 6-SIP Module |
| Package Dimensions | — | 17.78 mm x 29.48 mm x 10.67 mm |
| Lead Pitch | — | 2.54 mm |
| Technology | — | Piezoresistive, Monolithic Silicon |
| Signal Conditioning | — | On-chip, Temperature Compensated |