MPX5010DP vs MPX5010GSX Vergleich

Detaillierter Direktvergleich von MPX5010DP von NXP Semiconductors und MPX5010GSX von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPX5010DP MPX5010DP - 10kPa Differential Pressure Sensor, 5V | NXP/ST

MPX5010DP - 10kPa Differential Pressure Sensor, 5V | NXP/ST

MPX5010DP ✓ Aktiv
NXP Semiconductors
MPX5010GSX MPX5010GSX - 10kPa Integrated Pressure Sensor 6-SIP | NXP

MPX5010GSX - 10kPa Integrated Pressure Sensor 6-SIP | NXP

MPX5010GSX ✓ Aktiv

Spezifikationsvergleich

Parameter MPX5010DP MPX5010GSX
Marke NXP Semiconductors NXP Semiconductors
Kategorie Pressure Sensors Pressure Sensors
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $9,60 $10,25
Pressure Type Differential Vented Gauge
Operating Pressure Range 0 kPa to 10 kPa (0 to 1.45 PSI) 0 kPa to 10 kPa (0 to 1.45 PSI)
Maximum Overload Pressure [DATA_NEEDED: max overload kPa] [DATA_NEEDED: maximum overload pressure]
Sensitivity 450 mV/kPa (typical) —
Ausgangsspannungsbereich 0.2 V to 4.7 V —
Versorgungsspannung 4.75 V to 5.25 V (5 V typical) —
Versorgungsstrom [DATA_NEEDED: supply current mA] [DATA_NEEDED: supply current typical]
Linearity ±1.5% VFSS (typical, 0-85 C) —
Betriebstemperatur 0 C to +85 C (compensated) 0 C to 85 C
Storage Temperature [DATA_NEEDED: storage temperature C] —
Port Configuration Dual axial ports, 4.93 mm (0.19 in) tube —
Gehäuse 6-SIP Module —
Ausgangstyp Analog, ratiometric Analog Voltage
Montageart Through-hole (SIP) Through Hole
Technology Piezoresistive, monolithic silicon, on-chip signal conditioned Piezoresistive MEMS with on-chip ASIC
RoHS-Status Compliant Compliant
Output Voltage Span — 0.2 V to 4.7 V
Supply Voltage (VCC) — 4.5 V to 5.5 V
Accuracy — 1.0 % typical (per datasheet)
Response Time — [DATA_NEEDED: response time]
Port Size — Male 0.19 inch (4.93 mm) Tube, Side Port
Gehäuse / Bauform — 6-SIP Module (Case 867F)
Termination Style — Through-Hole PCB
Media Compatibility — Dry gases (air, non-corrosive)

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern