MPX5050DP vs MPX5700DP Vergleich
Detaillierter Direktvergleich von MPX5050DP von NXP Semiconductors und MPX5700DP von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPX5050DP | MPX5700DP |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,65 | $9,20 |
| Manufacturer | NXP Semiconductors | — |
| Sensortyp | Differential Pressure Sensor | — |
| Operating Principle | Piezoresistive (MEMS silicon) | — |
| Pressure Range | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) | — |
| Pressure Port Type | Differential, dual tube port (Male, 0.19" / 4.93 mm Tube) | — |
| Ausgangstyp | Analog ratiometric voltage | Analog voltage, ratiometric |
| Ausgangsspannungsbereich | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Full-Scale Span | 4.5 V typical | — |
| Versorgungsspannung | 5.0 V nominal (4.75 V to 5.25 V) | 4.75 V to 5.25 V (5 V typical) |
| Sensitivity | 90 mV/kPa typical | — |
| Accuracy | [DATA_NEEDED: full temperature accuracy band] | ±2.5% VFSS (0°C to 85°C) |
| Response Time | 1 ms typical | 1 ms (typical) |
| Overpressure Rating | 200 kPa | — |
| Betriebstemperatur | -40C to +125C | -40°C to +125°C |
| Gehäuse | 6-SIP Module (SOT1693-1 / Case 1351-01) | — |
| Montageart | Through-Hole (with dual pressure ports) | Through-hole, vertical SIP |
| Versorgungsstrom | [DATA_NEEDED: quiescent supply current] | [DATA_NEEDED: supply current] |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Pressure Type | — | Differential |
| Operating Pressure Range | — | 0 kPa to 700 kPa (0 psi to 101.5 psi) |
| Maximum Overload Pressure | — | [DATA_NEEDED: maximum overload pressure] |
| Full-Scale Span (VFSS) | — | 4.5 V (typical) |
| Port Style | — | Dual Male 0.19" (4.93 mm) Tube, Horizontal |
| Gehäuse / Bauform | — | 6-SIP Module (Case 867C-05) |
| Technology | — | Piezoresistive MEMS, bipolar signal conditioning |