MPX5700GP1117 vs MPX5700AP Vergleich
Detaillierter Direktvergleich von MPX5700GP1117 von NXP Semiconductors und MPX5700AP von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPX5700GP1117 | MPX5700AP |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,00 | $12,03 |
| Pressure Type | Vented Gauge | Absolute |
| Operating Pressure Range | 0 kPa to 700 kPa (0 to 101.53 PSI) | — |
| Maximum Overload Pressure | 2100 kPa | — |
| Versorgungsspannung | 4.75 V to 5.25 V (5 V typical) | 4.75 V to 5.25 V (5 V typical) |
| Versorgungsstrom | 10 mA typical | — |
| Ausgangstyp | Analog voltage, ratiometric | Analog, ratiometric |
| Ausgangsspannungsbereich | 0.2 V to 4.7 V (at 5 V supply) | 0.2 V to 4.7 V |
| Accuracy | ±2.5% (0°C to 85°C) | 1.5% over calibrated range |
| Response Time | 1 ms typical | — |
| Betriebstemperatur | -40°C to +125°C | -40°C to +125°C |
| Compensated Temperature | 0°C to 85°C | — |
| Port Style | GP - vertical port with 4.93 mm (0.19 in) tube | — |
| Gehäuse | 6-SIP through-hole module | 6-SIP Module (Case 867E-03) |
| Montageart | Through-Hole (vertical port) | Through-hole (SIP) |
| Signal Conditioning | On-chip amplified, temperature compensated | — |
| Calibration | On-chip laser-trimmed | — |
| RoHS-Status | Compliant | — |
| Pressure Range | — | 15 kPa to 700 kPa (2.18 PSI to 101.53 PSI) |
| Maximum Overpressure | — | 2800 kPa (406.11 PSI) |
| Sensitivity | — | 6.4 mV/kPa nominal |
| Port Type | — | Male 4.93 mm (0.19") tube |
| Technology | — | Piezoresistive, monolithic silicon |
| Packing Quantity | — | 20 per tray |
| Min Order Quantity | — | 200 |
| Lead-Free / RoHS | — | Compliant |