MPXV53GC7U vs MPXV5050GP Vergleich
Detaillierter Direktvergleich von MPXV53GC7U von NXP Semiconductors und MPXV5050GP von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPXV53GC7U - 50 kPa Uncompensated Vented Gauge Pressure Sensor | NXP
MPXV53GC7U ✓ Aktiv
Spezifikationsvergleich
| Parameter | MPXV53GC7U | MPXV5050GP |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7,20 | $10,66 |
| Sensortyp | Pressure Sensor, Vented Gauge | Vented Gauge Pressure Sensor |
| Operating Pressure Range | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) | — |
| Pressure Port Type | Male - 0.13" (3.17 mm) Tube, Top Port | — |
| Reference Type | Vented Gauge | — |
| Ausgangstyp | Analog Voltage (Wheatstone bridge) | Analog, ratiometric |
| Ausgangsspannung | 0 mV to 60 mV at 3 V excitation | 0.2 V to 4.7 V (at 5 V supply) |
| Sensitivity (typ) | 1.0 mV/kPa at 3 V excitation | — |
| Excitation Voltage | 3 V typical (up to 10 V max per datasheet) | — |
| Input Impedance | 1.0 kΩ to 3.0 kΩ | — |
| Output Impedance | 1.0 kΩ to 3.0 kΩ | — |
| Betriebstemperatur | -40 °C to +125 °C | 0C to +85C |
| Gehäuse / Bauform | 8-DIP (0.550", 13.97 mm) through-hole, top port | — |
| Montageart | Through Hole | Surface Mount |
| Compensation | Uncompensated (raw bridge output) | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | Compliant | Compliant |
| Pressure Range | — | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) |
| Versorgungsspannung | — | 4.75 V to 5.25 V (5 V typical) |
| Full-Scale Span | — | 4.5 V typical |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| Port Style | — | Male - 0.13 in (3.17 mm) vertical side tube |
| Gehäuse | — | 8-SMD, Gull Wing, Side Port (SO SOT1693-1) |
| Body Size | — | 12.06 mm x 12.06 mm x 3.38 mm |
| Lead Pitch | — | 2.54 mm |
| Signal Conditioning | — | On-chip bipolar op-amp, thin-film temp compensation |
| Min Package Quantity | — | 25 (NXP tray) |
| Min Order Quantity | — | 250 (NXP budgetary) |