MSC8156ESAG1000B vs MSC8156ESVT1000B Vergleich
Detaillierter Direktvergleich von MSC8156ESAG1000B von NXP Semiconductors und MSC8156ESVT1000B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ AbgekündigtNXP Semiconductors
MSC8156ESVT1000B - 6-Core SC3850 DSP @ 1GHz | NXP | FCBGA-783
MSC8156ESVT1000B ObsoleteSpezifikationsvergleich
| Parameter | MSC8156ESAG1000B | MSC8156ESVT1000B |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $112,00 | $138,00 |
| DSP Cores | 6x SC3850 StarCore cores | — |
| Core Clock Frequency | 1 GHz per core | — |
| Aggregate Performance | [DATA_NEEDED: aggregate MMACS rating] | — |
| Process Technology | 45 nm CMOS | — |
| Hardware Accelerator | MAPLE-B baseband accelerator (turbo decode) | — |
| Memory Controller | 64-bit DDR2/DDR3, up to 800 MT/s | — |
| SerDes Lanes | 2 lanes, SRIO or PCIe (selectable) | — |
| Ethernet | 1x Gigabit Ethernet MAC | — |
| Packet Engine | QUICC Engine subsystem | — |
| Security Engine | SEC 4.0 (Cryptographic accelerator) | — |
| Gehäuse | 783-ball FCBGA (29x29 mm) | 783-BBGA, FCBGA |
| Betriebstemperatur | 0C to +105C | [DATA_NEEDED: operating temperature range] |
| Versorgungsspannung | [DATA_NEEDED: core and I/O rail voltages] | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Lebenszyklusstatus | End of Life (per NXP PCN) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | StarCore |
| Type | — | SC3850 Six Core DSP |
| Number of Cores | — | 6 |
| Core Architecture | — | StarCore SC3850 |
| Clock Rate | — | 1 GHz |
| On-Chip RAM | — | 576 KB |
| Non-Volatile Memory | — | ROM 96 KB |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| Unified L2 Cache | — | 512 KB |
| Voltage - I/O | — | 2.50 V |
| Voltage - Core | — | 1.00 V |
| Schnittstelle | — | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART |
| Packaging | — | Tray |