P1012NSE2HFB vs P1013NSE2MHB557 Vergleich
Detaillierter Direktvergleich von P1012NSE2HFB von NXP Semiconductors und P1013NSE2MHB557 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP
P1012NSE2HFB ⚠ Letzte BestellmöglichkeitNXP Semiconductors
P1013NSE2MHB557 - QorIQ P1013 e500v2 MPU 1.2GHz 689-TEPBGA II | NXP
P1013NSE2MHB557 ✓ AktivSpezifikationsvergleich
| Parameter | P1012NSE2HFB | P1013NSE2MHB557 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,75 | $20,78 |
| Processor Series | QorIQ P1 | — |
| Processor Core | PowerPC e500v2 | — |
| Number of Cores | 1 | 1 |
| Core Architecture | 32-Bit Power Architecture | PowerPC e500v2 |
| Maximum Core Frequency | 800 MHz | 1.2 GHz |
| Process Technology | 45 nm CMOS | — |
| Memory Controller | DDR2/DDR3 with ECC | DDR2 / DDR3 with ECC, up to 800 MHz data rate |
| Ethernet | Integrated GbE (multiple MACs) | 3x 10/100/1000 Mbps Enhanced GMII/RGMII/TBI MACs |
| PCIe Controllers | PCIe Gen 2 (x1/x2/x4) | — |
| USB | USB 2.0 (host + device) | — |
| TDM Interfaces | 4 (T1/E1) | — |
| QUICC Engine (QE) | Yes (protocol offload) | — |
| SEC Security Accelerator | SEC 4.0 | — |
| Gehäuse | 689-TEPBGA II (31x31 mm) with exposed thermal pad | 689-TEPBGA II (31x31 mm) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Operating Temperature (Tj) | 0C to +125C | — |
| RoHS-Status | RoHS Compliant | Compliant |
| Lead Free Status | Lead Free | — |
| Packaging | Tray | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | QorIQ P1 |
| Datenbusbreite | — | 32-bit |
| PCI Express | — | 2x PCIe endpoints / root complex controllers |
| Security Accelerator | — | AES, 3DES, RC4, RSA, ECC, IPsec, SSL/TLS offload |
| L1 Cache | — | 32 KB I-cache + 32 KB D-cache |
| Betriebstemperaturbereich | — | -40 C to +85 C (industrial) |
| MSL (Moisture Sensitivity Level) | — | 3 (168 hours) |