P5020NSN1TNB vs P5020NXN1QMB Vergleich

Detaillierter Direktvergleich von P5020NSN1TNB von NXP Semiconductors und P5020NXN1QMB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
P5020NSN1TNB P5020NSN1TNB - QorIQ P5020 Dual-Core 1.8GHz SoC | NXP | Networking

P5020NSN1TNB - QorIQ P5020 Dual-Core 1.8GHz SoC | NXP | Networking

P5020NSN1TNB ✓ Aktiv
NXP Semiconductors
P5020NXN1QMB P5020NXN1QMB - QorIQ P5 2-Core 2.0GHz PowerPC e5500 MPU | NXP

P5020NXN1QMB - QorIQ P5 2-Core 2.0GHz PowerPC e5500 MPU | NXP

P5020NXN1QMB ✓ Aktiv

Spezifikationsvergleich

Parameter P5020NSN1TNB P5020NXN1QMB
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $215,00 $325,75
Architecture PowerPC e5500 64-bit dual-core PowerPC e5500, 64-bit
Core Count 2 (dual-core) 2
Maximum Core Frequency 2.0 GHz (per DigiKey listing); 1.8 GHz per Mouser/Freescale spec 2.0 GHz
Betriebstemperatur 0C to +105C —
Gehäuse 1295-FCPBGA (37.5 mm x 37.5 mm) 1295-ball FCBGA (HBGA) 37.5 mm x 37.5 mm
Memory Interface DDR3 / DDR3L with ECC —
PCIe Controllers Multiple lanes (Gen2/Gen3 capable) —
Ethernet Interfaces Gigabit Ethernet (multiple MACs) —
Serial RapidIO (sRIO) Yes —
Hardware Acceleration DPAA (Data Path Acceleration Architecture) for packet/crypto offload Packet parsing, pattern matching, queue management, SEC 4.0 crypto offload
Encryption Variant No ('N' indicator in suffix) —
Montageart Surface Mount (FCBGA ball grid) Surface Mount (BGA, 1.0 mm pitch)
MSL (Moisture Sensitivity Level) [DATA_NEEDED: MSL level] —
RoHS-Status Compliant Compliant
Reach Status Compliant —
Junction Temperature (Tj max) [DATA_NEEDED: junction temperature maximum] —
Process Node [DATA_NEEDED: process technology node] —
Manufacturer — NXP Semiconductors
Series — QorIQ P5
Betriebstemperaturbereich — -40 C to +105 C
Ball Pitch — 1.0 mm
Peripheral Interfaces — 3x 10GE + 8x 1GE Ethernet, 2x PCIe Gen 2, 2x Serial RapidIO Gen 2, 4x TDM
Memory Controller — DDR3 / DDR3L with ECC, up to 32 GB, 1333 MT/s
On-die Cache — 256 KB private L2 per core + 512 KB shared platform cache
Encryption Support — Disabled on NXN1 suffix (no encryption)
MSL-Level — 3 (168 hours)
Lead Free — Yes

Datenblätter & Ressourcen

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