RTAX250S-1LG624V vs RTAX1000SL-1LG624V Vergleich

Detaillierter Direktvergleich von RTAX250S-1LG624V von Microchip Technology und RTAX1000SL-1LG624V von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
RTAX250S-1LG624V RTAX250S-1LG624V - 250K-Gate Rad-Tolerant FPGA 1.5V | Microchip

RTAX250S-1LG624V - 250K-Gate Rad-Tolerant FPGA 1.5V | Microchip

RTAX250S-1LG624V ✓ Aktiv
Microchip Technology
RTAX1000SL-1LG624V RTAX1000SL-1LG624V - 1M-Gate Rad-Tolerant FPGA | Microchip

RTAX1000SL-1LG624V - 1M-Gate Rad-Tolerant FPGA | Microchip

RTAX1000SL-1LG624V ✓ Aktiv

Spezifikationsvergleich

Parameter RTAX250S-1LG624V RTAX1000SL-1LG624V
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $975,00
Family RTAX-S Radiation-Tolerant FPGA RTAX-SL (Radiation-Tolerant FPGA)
Equivalent Gate Count 250000 gates —
Configurable Logic Blocks (CLBs) 2816 —
Logic Cells 4224 18144
I/Os 248 —
Core Supply Voltage 1.5 V nominal 1.5 V
Speed Grade -1 -1
Gehäuse CGA624 (LG624), 624-column ceramic column grid array 624-pin LG (LGA)
Package Suffix V (leaded column finish) —
Betriebstemperatur -55C to +125C —
Technology CMOS, antifuse programmable —
Radiation Tolerance Radiation-tolerant (RTAX-S family, SEU-tolerant) [DATA_NEEDED: TID and SEU LET figures] —
Configuration Live at power-up, single chip, no boot PROM Live at power-up, single-chip
Montageart Surface Mount Surface Mount
MSL-Level [DATA_NEEDED: MSL level] —
RoHS-Status [DATA_NEEDED: RoHS status - ceramic space-grade package typically exempt] [DATA_NEEDED: RoHS Status]
Lebenszyklusstatus Active —
CLBs (Combinatorial Logic Blocks) — 12096
Equivalent System Gates — 1000000
ASIC Gates — 125000
Max CLB Combinatorial Delay — 0.93 ns
Process Technology — 0.15 um CMOS
Programmability Type — OTP anti-fuse
Embedded Memory — Embedded SRAM with FIFO control logic
Betriebstemperaturbereich — -55C to +125C
Application Domain — Space-flight systems

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